基于电磁屏蔽之挠性印制板差分阻抗关键因素探究  

Research on the key factors of differential impedance of flexibleprinted board based on electromagnetic shielding

作　　者：许伟廉 沈雷 黄李海 陈世金 黄伟 Xu Weilian;Shen Lei;Huang lihai;Chen Shijin;Huang Wei

机构地区：[1]博敏电子股份有限公司,广东梅州514768

出　　处：《印制电路信息》2022年第8期46-49,共4页Printed Circuit Information

基　　金：2021年广东省科技创新战略和乡村振兴战略专项资金项目--全微波高阶高密度印制电路关键技术研发及产业化(项目编号:2021A0101003)支持

摘　　要：为了避免印制电路板上信号传输过程受到电磁干扰,在挠性板上往往会设计一层电磁屏蔽膜用于抗电磁干扰。此时电磁屏蔽膜会影响传输线的阻抗。文章通过测试不同的阻抗参考平面,在满足传输线匹配的前提下,增大传输线宽度,保证产品的可靠性及生产良率,以供相关技术人员做参考。In order to avoid the electromagnetic interference during signal transmission on PCB,people usually design a layer of electromagnetic shielding film on the flexible plate.The electromagnetic shielding film will affect the impedance of the transmission line.In this paper,by testing different impedance reference planes,and based on the premise of satisfying the matching of transmission lines,the width of transmission lines is increased to ensure the reliability of products and production yield,so as to provide reference for relevant technical personnel.

关 键 词：挠性印制板 电磁屏蔽 阻抗 

分 类 号：TN41[电子电信—微电子学与固体电子学]