无掩模定域性电沉积微镍柱成形过程研究  

Research on the Forming Process of Maskless Localized Electrodeposition of Micro Nickel Column

作　　者：刘涛 贾卫平[1] 吴蒙华[1] 刘赛赛 肖雨晴 LIU Tao;JIA Weiping;WU Menghua;LIU Saisai;XIAO Yuqing(School of Mechanical Engineering,Dalian University,Dalian 116622,China)

机构地区：[1]大连大学机械工程学院,辽宁大连116622

出　　处：《电加工与模具》2022年第4期41-44,52,共5页Electromachining & Mould

基　　金：国家自然科学基金项目(51875071)。

摘　　要：为探究无掩模定域性电沉积微镍柱的成形过程,通过控制沉积时间利用体视显微镜观测微镍柱的形貌及尺寸,并采用Comsol软件研究不同沉积阶段下的阴极电流密度分布,验证了微镍柱的生长成形过程及其定域性。结果表明:电沉积成形微镍柱的过程主要分为表面基点、中间柱体和尖端生长3个部分。In order to explore the forming process of maskless localized electrodeposition of micro nickel column,the morphology and size of micro nickel column were observed by stereomicroscope by controlling the deposition time,and the cathode current density distribution at different deposition stages was studied by Comsol software,which verified the growing process and localization of micro nickel column.The result showed that the process of electrodeposition forming micro nickel column is mainly divided into three parts,including surface base point,intermediate pillar and tip growth.

关 键 词：无掩模 定域性 电沉积 尖端效应 

分 类 号：TG662[金属学及工艺—金属切削加工及机床]