高速PCB多面板过孔阻抗匹配的优化与改善  

Optimization and Improvement of High-speed PCB Multi-panel Through Hole Impedance Matching

作　　者：李继岚 韩冰 周昊[1] 蔡雄友[1] 

机构地区：[1]江门职业技术学院,广东江门529000

出　　处：《工业控制计算机》2022年第8期157-158,共2页Industrial Control Computer

摘　　要：随着5G通信时代的到来,人们对信号传输速率及信号完整性有了更高的要求。对于多层PCB板,过孔的使用会对高速信号传输及阻抗匹配有很大的影响。基于85ohm特征阻抗,以Rogers 4350b为基板设计了一款14层高速PCB板,利用ANSYS电磁仿真软件对过孔的阻抗进行仿真分析。通过仿真结果分析得到采用背钻并优化anti-pad的方式能很好地改善过孔的阻抗。With the advent of the 5G communication era,people have higher requirements on signal transmission rate and signal integrity.For multi-layer PCB,the use of through hole will have a great impact on high-speed signal transmission and impedance matching.Based on the 85ohm characteristic impedance,this paper designs a 14-layer high-speed PCB board based on Rogers 4350b,and ANSYS electromagnetic simulation software is used to simulate the impedance of the through hole.The simulation results show that the back drill and anti-pad optimization can improve the impedance of the through hole.

关 键 词：PCB 通孔 背钻 阻抗匹配 

分 类 号：TN41[电子电信—微电子学与固体电子学]