355nm皮秒激光对柔性电路板盲孔加工的研究  

Research on Blind Hole Machining of Flexible Circuit Board by 355nm Picosecond Laser

作　　者：陈志城 刘文鑫 吕凤洋 赵士忠 李岩 黄柳青 黄柳英 罗学涛[1] Chen Zhicheng;Liu Wenxin;Lü Fengyang;Zhao Shizhong;Li Yan;Huang Liuqing;Huang Liuying;Luo Xuetao(Xiamen Key Laboratory of Electronic Ceramic Materials and Devices,College of Material,Xiamen University,Xiamen,Fujian361000,China;Xiamen Apson Electronic Technology Co.Ltd.,Xiamen,Fujian361101,China)

机构地区：[1]厦门市电子陶瓷材料与器件重点实验室,厦门大学材料学院,福建厦门361000 [2]厦门爱谱生电子科技有限公司,福建厦门361101

出　　处：《应用激光》2022年第5期58-65,共8页Applied Laser

基　　金：厦门市重大科技项目(3502Z20201002)。

摘　　要：柔性电路板微盲孔技术目前是高密度互连制作工艺流程的关键一环。采用355nm紫外激光器对双面柔性覆铜板进行钻孔加工试验,研究了紫外激光的功率、扫描速度对两种柔性覆铜板(电解铜和压延铜)盲孔的形貌及质量的影响。试验发现,激光功率和扫描速度对盲孔质量有直接影响。研究结果表明,压延铜采用激光功率为4.5W、扫描速度为50mm/s时,电解铜采用激光功率为5.5W、扫描速度为150mm/s时,所加工出的盲孔质量最优。The micro-blind hole technology of flexible circuit board is a key part of high density interconnection fabrication process.In this paper,a 355nm UV laser was used to drill the double-sided flexible copper clad plates.The effects of UV laser power and scanning speed on the morphology and quality of blind holes of two kinds of flexible coppers(electrolytic copper and calendered copper)were studied.It is found that the laser power and scanning speed have direct effect on the quality of the blind hole.Results show that when the laser power is 4.5Wand the scanning speed is 50mm/s for calendering copper,and the laser power is 5.5Wand the scanning speed is 150mm/s for electrolytic copper,the quality of the blind hole is the best.

关 键 词：柔性电路板 紫外激光钻孔 电解铜 压延铜 

分 类 号：O436[机械工程—光学工程]