大尺寸CQFN封装板级组装可靠性研究  

Research on Board-Level Assembly Reliability of Large Size CQFN Packaging

作　　者：李杨[1] 朱家昌 明雪飞[1] 刘国柱[1] Li Yang;Zhu Jia-chang;Ming Xue-fei;Liu Guo-zhu(China Electronics Technology Group Corporation,NO.58 Research Institute,Jiangsu Wuxi 214000)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214000

出　　处：《电子质量》2022年第8期79-85,共7页Electronics Quality

摘　　要：CQFN封装具有可靠性高、性能优、重量轻等优点,日益受到高可靠器件应用的青睐。随着芯片尺寸不断增大,基于大尺寸CQFN外壳的封装形式越来越多被采用。该文通过对外壳尺寸为10 mm×10 mm的CQFN封装电路板级组装进行仿真分析和实验验证,探究了大尺寸CQFN外壳封装器件板级组装可靠性的薄弱点和影响因素,验证了其可靠性水平,为指导解决基于大尺寸CQFN外壳封装器件板级组装可靠性问题提供了参考。CQFN package has the advantages of high reliability,excellent performance and light weight,and is increasingly favored by high reliability device applications.With the increasing chip size,more and more packages based on large-size CQFN shell are adopted.Through simulation analysis and experimental verification on board-level assembly of CQFN package with shell size of 10 mm×10 mm,this paper explored the weak points and influencing factors of the reliability of the large-size CQFN package and verified its reliability level.It provides a reference for guiding and solving the reliability problem of board-level assembly of large-size CQFN shell packaging devices.

关 键 词：大尺寸CQFN外壳 板级组装 可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]