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作 者:范若欣 王保志 李以贵 Fan Ruoxin;Wang Baozhi;Li Yigui(School of Science,Shanghai Institute of Technology,Shanghai 201418,China;School of Electrical and Electronic Engineering,Shanghai Institute of Technology,Shanghai 201418,China)
机构地区:[1]上海应用技术大学理学院,上海201418 [2]上海应用技术大学电气与电子工程学院,上海201418
出 处:《微纳电子技术》2022年第8期807-812,共6页Micronanoelectronic Technology
基 金:国家自然科学基金资助项目(62104151)。
摘 要:针对传统的纳米压印装置的压头存在定位偏移、压印压力施加不均匀以及脱模过程中粘连等现象,设计并研制了防抖动的小型热压印装置。通过使五边形压头直连拉伸实验机以及对稳定装置和活塞帽形状的改进,可有效保证压印过程以及脱模过程中压印压力的均匀性。利用扫描电子显微镜(SEM)分别对压印压力7.5、20和40 MPa下制备的微结构进行了表征和分析。结果表明,压印压力为7.5 MPa时微结构的图形转移效果更优,制备的微结构最小直径可达3μm。验证了改进后的热压印装置可有效提高定位精度,进而保证压印精确性,且通过缩减热压装置的体积,可实现微结构低成本、高效及大规模的生产。To resolve problems of positioning shift, uneven imprinting pressure and adhesion during demoulding of the indenter of traditional nano-imprinting device, the anti-shaking compact thermal imprinting device was designed and developed. The direct connection of the pentagonal indenter to the tensile tester and improvements in the shapes of the stabilizer and piston cap can effectively ensure the uniformity of the imprinting pressure during the imprinting and demoulding processes. The microstructures prepared at imprinting pressures of 7.5, 20 and 40 MPa were characterized and analyzed by the scanning electron microscopy(SEM). The results show that the graphic transfer effect of the microstructure is better at an imprinting pressure of 7.5 MPa, and the minimum diameter of the prepared microstructure reaches 3 μm. It is demonstrated that the improved thermal imprinting device can effectively improve the positioning accuracy and thus ensure the imprinting accuracy, and by reducing the size of the hot imprinting device, it can achieve low-cost, high efficiency and large-scale production of microstructures.
分 类 号:TG385.5[金属学及工艺—金属压力加工]
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