刚挠结合和挠性电路板金属接地电阻改善  

Improvement of metal grounding resistance of Rigid-Flex and Flexible Circuit Boards

作　　者：王小时 阳厚平 孟昭光 赵南清 Wang Xiaoshi;Yang Houping;Meng Zhaoguang;Zhao Nanqing

机构地区：[1]东莞市五株电子科技有限公司,广东东莞523290

出　　处：《印制电路信息》2022年第9期24-27,共4页Printed Circuit Information

摘　　要：文章着重讲述刚挠结合板及柔性电路板的金属接地电阻不良原因分析及改善方法,主要从工程设计及实际生产两方面进行分析改善,从而避免接地阻值异常问题,保证客户品质要求。This paper focuses on the improvement methods of poor metal grounding resistance of rigid flex combination board and flexible circuit board,mainly from the two aspects of engineering design and actual production,so as to avoid the problem of abnormal grounding resistance and ensure the requirements of customers.

关 键 词：工程设计 接地阻值 导电胶 覆盖膜 

分 类 号：TN41[电子电信—微电子学与固体电子学]