Effect of chromium interlayer thickness on interfacial thermal conductance across copper/diamond interface  

作　　者：Xiaoyan Liu Fangyuan Sun Wei Wang Jie Zhao Luhua Wang Zhanxun Che Guangzhu Bai Xitao Wang Jinguo Wang Moon JKim Hailong Zhang 

机构地区：[1]State Key Laboratory for Advanced Metals and Materials,University of Science and Technology Beijing,Beijing 100083,China [2]School of Energy and Environmental Engineering,University of Science and Technology Beijing,Beijing 100083,China [3]Beijing Institute of Structure and Environment Engineering,Beijing 100076,China [4]Department of Materials Science and Engineering,University of Texas at Dallas,Richardson,TX 75080,USA [5]Institute of Engineering Thermophysics,Chinese Academy of Sciences,Beijing 100190,China [6]Shandong Provincial Key Laboratory for High Strength Lightweight Metallic Materials,Advanced Materials Institute,Qilu University of Technology(Shandong Academy of Sciences),Jinan 250014,China [7]Collaborative Innovation Center of Steel Technology,University of Science and Technology Beijing,Beijing 100083,China

出　　处：《International Journal of Minerals,Metallurgy and Materials》2022年第11期2020-2031,共12页矿物冶金与材料学报（英文版）

基　　金：financially supported by the National Natural Science Foundation of China (Nos. 51871014, 51571015);the National Youth Science Foundation, China (No. 51606193)

摘　　要：The thermal conductivity of diamond particles reinforced copper matrix composite as an attractive thermal management material is significantly lowered by the non-wetting heterointerface.The paper investigates the heat transport behavior between a 200-nm Cu layer and a single-crystalline diamond substrate inserted by a chromium(Cr)interlayer having a series of thicknesses from 150 nm down to 5 nm.The purpose is to detect the impact of the modifying interlayer thickness on the interfacial thermal conductance(h)between Cu and diamond.The time-domain thermoreflectance measurements suggest that the introduction of Cr interlayer dramatically improves the h between Cu and diamond owing to the enhanced interfacial adhesion and bridged dissimilar phonon states between Cu and diamond.The h value exhibits a decreasing trend as the Cr interlayer becomes thicker because of the increase in thermal resistance of Cr interlayer.The high h values are observed for the Cr interlayer thicknesses below 21 nm since phononic transport channel dominates the thermal conduction in the ultrathin Cr layer.The findings provide a way to tune the thermal conduction across the metal/nonmetal heterogeneous interface,which plays a pivotal role in designing materials and devices for thermal management applications.

关 键 词：SPUTTERING DIAMOND metal/nonmetal interface interfacial thermal conductance time-domain thermoreflectance 

分 类 号：TB333[一般工业技术—材料科学与工程]