引线框架贴膜工艺在QFN封装制程中的应用  

Application of Leadframe Taping Process in Semiconductor QFN Package

作　　者：郑嘉瑞 肖君军 周宽林 胡金 ZHENG Jiarui;XIAO Junjun;ZHOU Kuanlin;HU Jin(Harbin Institute of Technology(Shenzhen),School of Electronics and Information Engineering,Shenzhen 518055,China;Shenzhen Liande Automation Equipment Co.,Ltd.,Shenzhen 518109,China)

机构地区：[1]哈尔滨工业大学(深圳)电子与信息工程学院,广东深圳518055 [2]深圳市联得自动化装备股份有限公司,广东深圳518109

出　　处：《电子工业专用设备》2022年第4期8-11,共4页Equipment for Electronic Products Manufacturing

摘　　要：针对半导体封测领域方形扁平无引脚封装(QFN,Quad Flat No-leads Package)工艺中的引线框架贴膜工艺和装备,从QFN封装工艺制程、贴膜工艺、关键装备、应用及趋势进行了全面梳理和阐述。归纳总结了引线框架贴膜工艺的分类、国内外发展现状以及发展趋势,比较了主要半导体框架贴膜装备的主要参数,对贴膜工艺发展趋势进行了展望。研究结论对引线框架贴膜工艺在半导体框架贴膜的应用提供了参考,使半导体封测公司在选择相应贴膜装备时有了依据。This paper is to fully illustrate QFN package's taping process and its machine from the QFN package,taping process,key equipment,application and trends.It fully summarize the two taping process,the developing status and tendency for the taping process,and it compare the main parameters from the equipment supplier,forecast the development of this process in semiconductor.This result give the reference for the leadframe taping process and better the choosing of the taping equipment for semiconductor package company.

关 键 词：半导体 QFN封装 引线框架 贴膜工艺 

分 类 号：TN405.94[电子电信—微电子学与固体电子学]