蓝宝石晶片加工技术现状与发展趋势  

Current Situation and Development Trend of Sapphire Wafer Processing Technology

作　　者：莫东鸣[1] MO Dong-ming(School of Mechanical Engineering and Automation,Chongqing Industry Polytechnic College,Chongqing 401120,China)

机构地区：[1]重庆工业职业技术学院机械工程与自动化学院,重庆401120

出　　处：《应用能源技术》2022年第8期43-47,共5页Applied Energy Technology

基　　金：重庆市高等教育教学改革项目(203699);重庆市基础研究与前沿探索专项项目(cstc2018-jcyjAX0597)。

摘　　要：蓝宝石晶体具有强度高、耐高温、耐化学腐蚀、抗磨损等优良性能,在半导体照明、国防军工、航天航空、智能穿戴、电子产品等领域得到广泛的应用。本文对实现蓝宝石高效低损伤的加工技术进行了总结和分析,并指出蓝宝石晶体加工过程中存在的问题及未来发展的趋势。Sapphire crystal has excellent properties such as high strength,high temperature resistance,chemical corrosion resistance and wear resistance.It is widely used in semiconductor lighting,national defense and military industry,aerospace and intelligent wearable consumer electronics.This paper summarizes and analyzes the processing technology of sapphire with high efficiency and low damage,and points out the problems existing in the processing of sapphire crystal and the future development trend.

关 键 词：蓝宝石晶片 加工技术 切割 研磨 抛光 

分 类 号：O78[理学—晶体学]