国内某重点企业化学机械抛光液相关专利技术分析  

Patent analysis of chemical mechanical polishing slurries for a key domestic enterprise

作　　者：姜小青[1] 史巍[1] 秦珊 JIANG Xiao-qing;SHI Wei;QIN Shan(Patent Examination Cooperation Beijing Center,State Intellectual Property Office Patent Office,Beijing 100160,China)

机构地区：[1]国家知识产权局专利局专利审查协作北京中心,北京100160

出　　处：《精细与专用化学品》2022年第9期1-4,共4页Fine and Specialty Chemicals

摘　　要：化学机械抛光是半导体先进制程中的关键技术,化学机械抛光液是影响化学机械抛光效果的重要因素之一。对国内某重点企业的化学机械抛光液在申请态势、地域分布、应用对象、技术分支以及重点专利等方面进行分析,并对企业的专利布局和应急策略提出了建议。Chemical mechanical polishing was a key technology in the advanced semiconductor manufacturing process.Chemical mechanical polishing slurry was one of the important factors affecting the effect of chemical mechanical polishing.We analyzed the application situation,geographical distribution,application objects,technology branches,key patents and other aspects of the chemical mechanical polishing slurries of a key domestic enterprise and gave suggestions on the patent layout and emergency strategies for the enterprise.

关 键 词：化学机械抛光 专利分析 

分 类 号：TN305[电子电信—物理电子学]