PoP元件热翘曲数值模拟及优化研究  

Numerical simulation and optimization of thermal warpage of PoP components

作　　者：葛一铭 徐琴 曹鹏[3] 沈飞 柯燎亮 GE Yiming;XU Qin;CAO Peng;SHEN Fei;KE Liaoliang(School of Mechanical Engineering,Tianjin University,Tianjin300072,China;Chengdu Hongke Electronic Technology Co.,Ltd.,Chengdu610100,China;China Academy of Aerospace Standardization and Product Assurance,Beijing100071,China)

机构地区：[1]天津大学机械工程学院,天津300072 [2]成都宏科电子科技有限公司,四川成都610100 [3]中国航天标准化与产品保证研究院,北京100071

出　　处：《电子元件与材料》2022年第9期980-986,共7页Electronic Components And Materials

基　　金：国家自然科学基金杰出青年科学基金(11725207)。

摘　　要：随着电子元器件产业的发展,对封装的集成性和可靠性也提出了更高的要求。作为一种典型失效形式,翘曲引发的芯片脱层、脱焊和开裂等问题,往往对成品率及封装可靠性产生重要影响。为了探究芯片的翘曲演变规律,基于ANSYS有限元软件,建立了叠层封装(Package on Package,PoP)结构热翘曲的仿真模型,考虑了焊料的Anand黏塑性本构模型,讨论了灌封胶膨胀系数、芯片厚度、焊球弹性模量对结构热翘曲的影响,并针对芯片的翘曲控制提出了优化建议。结果表明,芯片受热时的主要翘曲形态为弓曲,在从高温到低温变化的过程中,其翘曲形态逐渐由上凸转变为下凹。上层封装芯片的翘曲相对较大,灌封胶的热膨胀系数及芯片厚度是翘曲的主要影响因素。With the development of the electronic components industry,higher requirements are put forward for the integration and reliability of chip packaging.As one of the typical failure modes,chip delamination,debonding and cracking caused by warping have an important impact on the package reliability.In order to investigate the chip warpage behavior,the simulation model of thermal warpage of a package on package(PoP)structure was established by using ANSYS finite element analysis software.The Anand viscoplastic constitutive model of the solder was considered in the PoP structure.The effects of the thermal expansion coefficient of the potting,the thickness of the chip,and the elastic modulus of the solder ball on the thermal warping of the PoP structure were evaluated.The results indicate that the main warping mode of the chip is bow-shape warping when heated.During the transition from high temperature to low temperature,the warping mode of the chip gradually changes from convex shape to concave shape.The warpage of the upper-layer chips are relatively large.The thermal expansion coefficient of the potting and the thickness of the chip are the major influencing factors of the thermal warpage.

关 键 词：叠层封装 热翘曲 数值模拟 有限元分析 本构模型 

分 类 号：TN305.94[电子电信—物理电子学]