聚苯醚基覆铜板热性能和介电性能研究  

Thermal and Dielectric Properties of Copper Clad Laminate based on PPO

作　　者：朱新军[1,3] 邹水平 谢富春 崔国记[1] 张运湘 Zhu Xinjun;Zou Shuiping;Xie Fuchun;Cui Guoji;Zhang Yunxiang(Luoyang Institute of Science and Technology,Luoyang 471023;Ventec Electronics Co.,Ltd.,Suzhou 215129;Luoyang Institute of Cutting-edge Technology,Luoyang 471033,China)

机构地区：[1]洛阳理工学院,河南洛阳471023 [2]腾辉电子(苏州)有限公司,江苏苏州215129 [3]洛阳尖端技术研究院,河南洛阳471033

出　　处：《广东化工》2022年第20期47-49,共3页Guangdong Chemical Industry

基　　金：河南省重点研发与推广专项(科技攻关)(192102210020)。

摘　　要：本文利用多官能度的可固化聚苯醚树脂与溶剂、填料、阻燃剂等助剂混合配制胶液,经过浸胶、烘干、压合等工艺制备了聚苯醚基的覆铜板。利用热重分析仪、热机械分析仪设备测试分析了覆铜板样品的热失重数据、玻璃化转变温度、热膨胀系数等热性能,利用矢量网格分析仪测试了样品的介电常数和介电损耗数据。结果表明:覆铜板的热性能和介电性能受聚苯醚树脂的分子量、可交联双键官能度及树脂含量的影响,分子量小、可固化官能度多的样品热失重中开始分解温度、玻璃化转变温度较高,膨胀系数小和介电性能较好。The curable poly(2,6-dimethyl-1,4-phenylene oxide)(PPO) with polyfunctional group were dissolved in solvent to prepared mixtures containing filler,flame retardant and other additives. Copper clad laminates(CCL) based on the PPO resin were made by processing of dipping, drying and pressing. The thermal properties including the temperatures of thermal decomposition, glass transition and thermal expansion coefficient of the CCLs were determined by thermogravimetric analysis(TG) and Thermomechanical analysis(TMA). The dielectric constant and dielectric loss were measured by vector network analyzer. The results showed that the thermal and electrical properties were affected by average molecular weight, the number of cross-linking group, content of the curable PPO resins. The CCLs prepared by the curable PPO with low average molecular weight and polyfunctional group showed higher temperatures of thermal decomposition and glass transition and lower thermal expansion coefficient, dielectric constant and dielectric loss.

关 键 词：聚苯醚 可固化 改性 覆铜板 热性能 介电性能 

分 类 号：TQ317.3[化学工程—高聚物工业]