有机酸性污染物对铜质材料的腐蚀影响  

Corrosion Effect of Organic Acidic Pollutants on Copper Materials

作　　者：马圆圆 闫莹 王伟伟[1] 余啸 宋鸿宇 周浩 吴来明[3] 蔡兰坤[1] MA Yuanyuan;YAN Ying;WANG Weiwei;YU Xiao;SONG Hongyu;ZHOU Hao;WU Laiming;CAI Lankun(School of Resources and Environmental Engineering,East China University of Science and Technology,National Key Laboratory of Environmental Risk Assessment and Control for Environmental Protection Chemical Processes,Shanghai 200237,China;Shandong Key Laboratory of Corrosion Science,Institute of Oceanology,Chinese Academy of Sciences,Qingdao 266000,China;Key Scientific Research Base of Museum Environment,State Administration for Cultural Heritage,Shanghai Museum,Shanghai 200050,China)

机构地区：[1]华东理工大学资源与环境工程学院,国家环境保护化工过程环境风险评价与控制重点实验室,上海200237 [2]中国科学院海洋研究所山东省腐蚀科学重点实验室,青岛266000 [3]上海博物馆馆藏文物保存环境国家文物局重点科研基地,上海200050

出　　处：《腐蚀与防护》2022年第7期18-23,共6页Corrosion & Protection

基　　金：国家自然科学基金(51671117);国家重点研发计划(2020YFC1522502);山东省腐蚀科学重点实验室开放课题;大学生创新创业训练计划。

摘　　要：采用薄液膜电化学方法,研究了纯铜在含甲酸或乙酸大气模拟腐蚀液中的腐蚀行为,结合SEM-EDS和XRD等表征了经过模拟暴露试验后试样表面的腐蚀产物。结果表明:当液膜厚度约为100μm条件下,铜的腐蚀速率随着甲酸或乙酸浓度的升高而增加;当甲酸和乙酸的浓度相同时,甲酸对铜的腐蚀影响更大;铜在两种有机酸环境中的最终腐蚀产物主要是氧化亚铜、甲酸铜晶体和乙酸铜晶体。The corrosion behavior of pure copper in simulated corrosive solution containing formic acid or acetic acid was studied by thin-film electrochemical method,and the corrosion products on the surface of samples after simulated exposure test were characterized by SEM-EDS and XRD.The results showed that when the liquid film thickness was about 100μm,the corrosion rate of copper increased with the increase of the concentration of formic acid or acetic acid;when the concentrations of formic acid and acetic acid were the same,formic acid had a relatively more serious effect on the corrosion of copper.The final corrosion products of copper in two organic acid environments were mainly cuprous oxide,copper formate crystals and copper acetate crystals.

关 键 词：铜 有机酸 薄层液膜 腐蚀 

分 类 号：TG172.7[金属学及工艺—金属表面处理]