硅微粉球形度对环氧模塑料熔体流动性的影响  

Effect of Sphericity of Silica Powder on Melt Flow of Epoxy Molding Compounds

作　　者：陈晓飞 CHEN Xiaofei(Zhejiang Huafei Electronic Material Co.,Ltd.,Huzhou 313000,China)

机构地区：[1]浙江华飞电子基材有限公司,浙江湖州313000

出　　处：《电子与封装》2022年第10期7-11,共5页Electronics & Packaging

摘　　要：硅微粉是电子封装用环氧模塑料的重要组成成分,其外形尺寸及级配等因素会严重影响环氧模塑料的加工及物理性能,尤其是环氧模塑料的熔体流动性。目前国内外对硅微粉的球形度没有统一的标准,也没有硅微粉球形度对环氧模塑料熔体流动性影响方面的报道。通过在球形硅微粉中添加角形硅微粉的方式能很好地表征硅微粉的球形度,研究和分析了不同球形度的硅微粉对环氧模塑料熔体流动性的影响。Silicon powder is an important component of epoxy molding compounds used in electronic packaging,and its dimensions and gradation can seriously affect the processing and physical properties of epoxy molding compounds,especially the melt flow of epoxy molding compounds.At present,there is no unified standard for the sphericity of silicon powder at home and abroad,and there is no report on the influence of the sphericity of silicon powder on the melt flow of epoxy molding compounds.The sphericity of silicon powder is characterized by adding angular silicon powder to spherical silicon powder,so as to study and analyze the effect of silicon powder with different sphericity on the flow of epoxy molding compounds.

关 键 词：硅微粉 球形度 环氧模塑料 熔体流动性 

分 类 号：TN305.94[电子电信—物理电子学]