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作 者:林宇翔 王方霄 苏宇辰 李明奇[4] LIN Yuxiang;WANG Fangxiao;SU Yuchen;LI Mingqi(School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China;School of Information and Communication Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China;School of Computer Science and Engineering,University of Electronic Science and Technology of China,Chengdu 611731,China;School of Mathematical Sciences,University of Electronic Science and Technology of China,Chengdu 611731,China)
机构地区:[1]电子科技大学电子科学与工程学院,成都611731 [2]电子科技大学信息与通信工程学院,成都611731 [3]电子科技大学计算机科学与工程学院,成都611731 [4]电子科技大学数学科学学院,成都611731
出 处:《实验科学与技术》2022年第5期45-51,共7页Experiment Science and Technology
基 金:电子科技大学研究生精品课程建设项目(JPKC20192-39)。
摘 要:针对回流焊工作过程中的热量传递问题和炉温曲线优化问题,利用热传导规律建立了相应模型。首先,通过对回焊炉内流入流出微元的热量进行分析,得到了炉内环境空气温度变化规律。然后结合热传导方程与相关约束条件建立了PCB板中的热量传递模型。以此结合参数随温度变化的影响将整个PCB板运动过程分为5个阶段,并根据实验数据对不同阶段的传导影响因子、对流辐射叠加影响因子进行搜索求解。运用有限差分法求解得到焊接区域中心的温度变化情况。为了确定最大过炉速度以及设计炉温曲线,该文设计了变步长搜索算法。For the heat transfer problem and the optimization of the furnace temperature profile in the reflow soldering working process,the corresponding model was established using the heat conduction law.Firstly,by analyzing the heat flowing into and out of a micro-element in the reflow oven,the variation of ambient air temperature in the oven is obtained.Then the heat transfer model in the PCB is established by combining the heat conduction equation with the relevant constraints.In this way,the whole PCB motion process is divided into five stages by combining the fact that parameters vary with temperature,and the conduction influence factor and convection radiation superposition influence factor are searched and solved according to the experimental data of different stages.The temperature variation in the center of the soldering area is obtained using the finite difference method.In order to determine the maximum over-burner speed as well as to design the furnace temperature profile,a variable-step search algorithm is designed in this paper.
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