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作 者:李宇 吴圣众 吴克勤 叶世俊 林志伟 饶久平[1] LI Yu;WU Sheng-zhong;WU Ke-qin;YE Shi-jun;LIN Zhi-wei;RAO Jiu-ping(College of Material Engineering,Fujian Agriculture and Forestry University,Fuzhou 350002,Fujian,China;Furen Group Forest Industry Co.Ltd.,Nanping 354000,Fujian,China)
机构地区:[1]福建农林大学材料工程学院,福建福州350002 [2]福人集团森林工业有限公司,福建南平354000
出 处:《竹子学报》2022年第2期7-14,共8页Journal of Bamboo Research
基 金:福建省科技计划项目(2020Y3003);福建农林大学横向科研课题(KH200015A)。
摘 要:以毛竹加工剩余物制备的竹刨花为原料,探讨了厚度为4.5 mm超薄竹刨花板的生产工艺。采用响应面Box-Behnken试验设计方法研究不同施胶量、热压温度、时间、压力对超薄竹刨花板主要物理力学性能的影响,并分析优化前后超薄竹刨花板的断面密度分布。结果表明,超薄竹刨花板的较佳制备工艺参数为脲醛树脂施胶量12.2%,热压温度182℃,热压时间30 s·mm^(-1),热压压力2.7 MPa。在此条件下制备的超薄竹刨花板产品的静曲强度、弹性模量、内胶合强度和2 h吸水厚度膨胀率分别为13.8 MPa、2183 MPa、0.56 MPa和7.87%,均满足刨花板国家标准GB/T 4897—2015和超薄竹刨花板团体标准T/CNFPLA 3013—2021的要求;与响应面预测值对比,各项指标误差值均在10%以内。制备工艺参数会影响超薄竹刨花板断面密度分布,从而影响内胶合强度和静曲强度等主要物理力学性能。Using bamboo particles prepared from bamboo processing residues as raw materials,the production process of 4.5 mm ultra-thin bamboo particleboard was discussed.The effects of different adhesive amounts,hot pressing temperatures,times and pressures on the main physical and mechanical properties of ultra-thin bamboo particleboard were investigated by response surface Box-Behnken design methodology,and the vertical density profile was analyzed.The results indicated that the optimal processing parameters were adhesive amount level of 12.2%,hot pressing temperature of 182℃,hot pressing time of 30 s·mm^(-1)and hot pressing pressure of 2.7 MPa.Under these conditions,MOR,MOE,IB and TS of the ultra-thin bamboo particleboard were 13.8 MPa,2183 MPa,0.56 MPa and 7.87%,respectively,which meet China national standard GB/T 4897—2015 and China National Forest Products Industry Association group standard T/CNFPLA 3013—2021.Compared with the predicted values of the response surface,the error values of all indexes were less than 10%.The vertical density profile of ultra-thin bamboo particleboard was affected by the preparation parameters,which influenced the main physical and mechanical properties such as internal bond strength and modulus of rupture.
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