多场耦合研究PCB电镀铜  

Research on Copper Electrodeposition of PCB Based on Multi-Physics Coupling

作　　者：冀林仙[1] 王跃峰[1] JI Linxian;WANG Yuefeng(Department of Physics and Electronic Engineering,Yuncheng University,Yuncheng 044000,China)

机构地区：[1]运城学院物理与电子工程系,山西运城044000

出　　处：《电镀与精饰》2022年第11期18-23,共6页Plating & Finishing

基　　金：山西省高等学校科技创新项目(2020L0553);运城学院科研项目(YQ-2020022)。

摘　　要：为提高印制电路板电镀铜的镀层均匀性,采用多物理场耦合的有限元方法构建电镀铜模型,探讨了阴极板间距、液面高度、阳极挡板对镀层均匀性的影响,并设计正交实验获得了优化的电镀铜工艺参数。结果表明,阴极板间距越小,镀层越均匀。较低的液面、增加阳极挡板,有利于获得均匀的镀层。采用优化的参数电镀铜,阴极COV(镀层均匀性)值为4.7%。这些结论为工业电镀铜工艺的优化提供了一定的理论与实践指导。In order to improve the uniformity of copper electrodeposition on printed circuit board,the finite element method based on multi-physics coupling was used to structure the model of electrodeposit‐ed copper.The influences of the distance between cathodes,height of plating solution and baffle of anode on uniformity of electrodeposited layer were discussed.Further,the optimized parameters of copper electrodeposition were obtained by orthogonal experiment.The results show that the smaller the distance between cathode is,the more uniform the electrodeposition is.Lower liquid level and adding anode baffle help to improve the uniformity of electrodeposition.COV(coating uniformity)is 4.7% when copper is electrodeposited with optimized parameters.These conclusions provide some theoretical and practical guidance for the optimization of industrial copper electrodeposited process.

关 键 词：印制电路 电镀铜 多场耦合 

分 类 号：TQ153.1[化学工程—电化学工业]