CQFN封装电特性研究  

Research on the Electrical Characteristics of CQFN Package

作　　者：张荣臻 姚昕 张元伟 ZHANG Rongzhen;YAO Xin;ZHANG Yuanwei(Wuxi Zhongwei High-tech Electronics Co.,Ltd.,Wuxi 214072,China)

机构地区：[1]无锡中微高科电子有限公司,江苏无锡214072

出　　处：《电子产品可靠性与环境试验》2022年第5期40-44,共5页Electronic Product Reliability and Environmental Testing

摘　　要：对CQFN封装进行了介绍,探讨了CQFN外壳不同的互连结构及信号完整性的评估方法。针对某款CQFN24陶瓷外壳,研究了封装的信号传输特性;并采用仿真方法对比了不同传输结构对信号完整性的影响。针对差分信号的指标要求,提出了优化传输结构的方法,对于提高CQFN封装电特性具有一定的参考作用。The CQFN package is introduced,and the different interconnect structures and signal integrity evaluation methods of the CQFN package are discussed.For a CQFN 24 case,the signal transmission characteristics of the package are studied and the influence of different transmission structures on signal integrity is compared by simulation method.Aiming at the index requirements of differentials signals,a method of optimizing the transmission structure is proposed,which has certain reference significance for improving the electrical characteristics of CQFN packages.

关 键 词：陶瓷四边无引脚扁平封装 陶瓷封装 信号仿真 信号完整性 

分 类 号：TN405[电子电信—微电子学与固体电子学] TP391.99[自动化与计算机技术—计算机应用技术]