元器件失效分析在核级产品的应用  

Application of Component Failure Analysis in Nuclear Grade Products

作　　者：邓玉娇 陈荣华[1] DENG Yujiao;CHEN Ronghua(School of Nuclear Science and Technology,Xi’an Jiaotong University,Xi’an 710049,China)

机构地区：[1]西安交通大学核科学与技术学院,陕西西安710049

出　　处：《自动化仪表》2022年第11期91-94,共4页Process Automation Instrumentation

摘　　要：核级产品电子元器件失效分析主要是为了发现并确定元器件的失效机理和原因,并反馈给研制和使用方作为改进的依据,以防止类似的失效再现,从而达到提高产品品质和可靠性的目的。某项目实施过程中,某模块遇到批量性的同种问题:正常输入20 mA时,理论输出是20 mA,而实际所有通道无输出。对失效样品采取电参数测试、内部分析、失效定位等多种方式分析得知,样品塑封料存在空洞。进行回流焊时,样品内部重熔的焊料填充到空洞中,造成输出端引脚短路。通过多种纠正预防措施的施行,有效解决了核级产品制造过程出现的元器件失效问题。开展电子元器件失效分析、查明电子元器件的失效机理和原因、提出改进和预防措施,对推动核级电子元器件失效分析技术的广泛应用、缩短电子元器件的研制周期、提升元器件和电子产品的质量和可靠性水平意义重大。The main purpose of the failure analysis of electronic components of nuclear grade products is to discover and determine the failure mechanism and causes of components, and feedback to the developer and user as a basis for improvement, to prevent similar failures from recurring, so as to achieve the purpose of improving product quality and reliability.During the implementation of a project, a module encountered a batch of the same problem: normal input 20 mA, theoretical output is 20 mA, but the actual all channels no output.The failed sample is analyzed by electrical parameter testing, internal analysis, and failure location, etc.It is found that the sample had a hole in the plastic seal material, and when reflow soldering is performed, the remelted solder inside the sample filled the hole, causing a short circuit on the output pins.Through the implementation of various corrective and preventive measures, the problem of component failure in the manufacturing process of nuclear grade products is effectively solved.Conducting failure analysis of electronic components, identifying the failure mechanism and causes of electronic components, and proposing improvement and prevention measures are of great significance to promote the wide application of failure analysis technology for nuclear grade electronic components, shorten the development cycle of electronic components, and improve the quality and reliability level of components and electronic products.

关 键 词：核级产品 电子元器件 元器件失效 失效分析 可靠性 质量 回流焊 

分 类 号：TH-39[机械工程]