高填充体系覆铜板生产特点  

The production characteristics of Copper Clad Laminate with high filling system

作　　者：刘锦琼 张华[1] 刘文龙[1] 钟健伟[1] Liu Jinqiong;Zhang Hua;Liu Wenlong;Zhong Jianwei

机构地区：[1]广东生益科技股份有限公司,广东东莞523808

出　　处：《印制电路信息》2022年第11期4-7,共4页Printed Circuit Information

摘　　要：高填充体系覆铜板一般指填料比例为40%~70%的产品。由于其填料比例过高,因此其生产工艺和控制不同于一般体系产品。文章结合生产实际,总结了高填充体系在混胶、上胶、层压过程中的生产特点及对应的改善方法,有利于提升产品的质量。The Copper Clad Laminate with high filling system generally refers to the proportion of filler 40%~70%product.Due to its high proportion of filler,its production process and control are different from the common system products.This article combines with the production practice,summarizes the production characteristics and corresponding improvement methods of high filling system in the process of rubber mixing,gluing and laminating,which is beneficial to improve the quality of products.

关 键 词：覆铜板 高填充 生产特点 

分 类 号：TN41[电子电信—微电子学与固体电子学]