第三代半导体器件用高可靠性环氧塑封料的制备  

Preparation of High Reliability Epoxy Molding Compound for Third Generation Semiconductor Devices

作　　者：王殿年 李泽亮 郭本东 段嘉伟 WANG Diannian;LI Zeliang;GUO Bendong;DUAN Jiawei(Eterkon Semiconductor Materials Co.,Ltd.,Kunshan 215301,China)

机构地区：[1]昆山兴凯半导体材料有限公司,江苏昆山215301

出　　处：《电子与封装》2022年第11期6-12,共7页Electronics & Packaging

摘　　要：第三代半导体器件以其在高温、高压、高频条件下稳定运行的特点深受市场青睐。环氧塑封料(EMC)对器件的可靠性起着至关重要的作用。通过多种类型树脂的调配和不同离子捕捉剂的添加,优化制配出了1种高性能的环氧塑封料,该环氧塑封料的玻璃化转变温度(T_(g))高达190℃,对金属银的密着力高达73.5 N/cm^(2),其阻燃级别达到了UL94 V-0级。通过模拟封装验证了环氧塑封料的可靠性,结果表明,实验室模拟的封装样品能达到吸湿敏感度等级一级(MSL1)。该样品经过封装厂的多方面验证,在1700 V的Si C半导体场效应晶体管(MOSFET)上表现出良好的可靠性,通过了电性能可靠性、环境可靠性、使用可靠性等一系列可靠性考核。这款高可靠性环氧塑封料有望应用于耐高温、耐高压的第三代半导体器件上。The third generation semiconductor devices are favored by the market for their stable operation under high temperature, high voltage, and high frequency conditions. Epoxy molding compound(EMC) plays an important role in the reliability of devices. Through the preparation of various types of resin and the addition of various ion scavengers, a high performance EMC is optimized. The glass transition temperature(T_(g)) of the EMC is up to 190 ℃, the adhesion to metal silver is up to 73.5 N/cm^(2), and its flame retardant grade reaches UL94 V-0. The reliability of the EMC is verified by simulation packaging, and the results show that the simulated packaging samples in laboratory can reach the first level of moisture absorption sensitivity(MSL1).The sample has been verified in many aspects by packaging factory and has shown good reliability on the Si C semiconductor field effect transistor(MOSFET) with a voltage up to 1700 V, passing a series of reliability tests such as electrical performance reliability, environmental reliability, and use reliability. This high reliability epoxy molding compound is expected to be used in third generation semiconductor devices with the high temperature and high voltage resistance.

关 键 词：第三代半导体器件 环氧塑封料 高可靠性 

分 类 号：TN305.94[电子电信—物理电子学]