IC封装用毛细管劈刀的应用和研究进展  

Application and Research Progress on Bonding Capillary in IC Packaging

作　　者：罗国强 张艺炜[2] 高忠梅 袁欢 涂溶 沈强 LUO Guoqiang;ZHANG Yiwei;GAO Zhongmei;YUAN Huan;TU Rong;SHEN Qiang(Chaozhou Branch of Chemistry and Chemical Engineering Guangdong Laboratory,Chaozhou 521031,China;Yazhou Bay Institute,Wuhan University of Technology,Sanya 572024,China;School of Mechanical and Electronic Engineering,Wuhan University of Technology,Wuhan 430070,China;State Key Laboratory of Advanced Technology for Materials Synthesis and Processing,Wuhan University of Technology,Wuhan 430070,China)

机构地区：[1]化学与精细化工广东省实验室潮州分中心,广东潮州521031 [2]武汉理工大学海南研究院,海南三亚572024 [3]武汉理工大学机电工程学院,武汉430070 [4]武汉理工大学材料复合新技术国家重点实验室,武汉430070

出　　处：《电子工艺技术》2022年第6期311-316,364,共7页Electronics Process Technology

基　　金：广东省重点领域研发计划项目(2021B0707050001,2020B010181001);武汉理工大学三亚科教园开放基金(2021KF0010)。

摘　　要：综述了毛细管劈刀的研究与应用进展,主要包括毛细管劈刀的工作过程、材料成分、外形结构、老化清理以及新型毛细管劈刀。重点阐述了数值模拟方法在毛细管劈刀研究中的应用,指出通过优化毛细管劈刀结构提高键合质量是目前毛细管劈刀研究的重点,并提出毛细管劈刀今后的发展方向。The research and application progress on bonding capillary is summarized,including its working process,material composition,structure,aging cleaning and new types of bonding capillary.The application of numerical simulation in the research of bonding capillary is discussed significantly.Improving the bonding quality by optimizing the structure of bonding capillary shall be the research focuses,and the future development trends for bonding capillary are finally proposed.

关 键 词：毛细管劈刀 引线键合 结构优化 数值模拟 

分 类 号：TN305[电子电信—物理电子学]