MLCC端电极孔洞问题分析  

Analysis of Hole Problems in MLCC Terminal Electrode

作　　者：田述仁 陆亨 TIAN Shuren;LU Heng(State Key Laboratory of Advanced Materials and Electronic Components,Fenghua Advanced Technology Co.,Ltd.,Zhaoqing 526020,China)

机构地区：[1]广东风华高新科技股份有限公司新型电子元器件关键材料与工艺国家重点实验室,广东肇庆526020

出　　处：《电子工艺技术》2022年第6期327-329,333,共4页Electronics Process Technology

基　　金：广东省省属国有企业技术创新专项(2022B0101090003)。

摘　　要：端电极孔洞是MLCC最为常见的质量缺陷之一,严重影响MLCC的性能及可靠性,易导致容量异常、绝缘电阻下降、焊接不良等问题。主要从材料、工艺和生产环境方面对端电极孔洞问题进行分析,结果发现产生端电极孔洞的主要原因在于端电极中引入气泡或者产生气体。通过优化端浆组分、倒角工艺和封端工艺,控制端浆黏度,提高烧端时的排胶效果,避免引入杂质等措施,可以防止端电极孔洞问题发生。The terminal electrode hole is one of the most common defects of MLCCs,which seriously affects performance and reliability of MLCCs,and easily leads to abnormal capacitance,declined insulation resistance and poor soldering.The problem of terminal electrode hole is analyzed from aspects of materials,processes and production environment.The results show that the main courses for terminal electrode hole are the introduction of bubbles or gas into the terminal electrode.The terminal electrode problem can be avoided by optimizing terminal electrode paste,chamfering process and terminating process,and controlling viscosity of terminal electrode paste,as well as enhancing binder burn out during term-sintering and avoiding introduction of impurities.

关 键 词：端电极 孔洞 MLCC 气泡 倒角 封端 烧端 

分 类 号：TN605[电子电信—电路与系统]