厚膜基板上热沉辅助芯片焊接技术  

Soldering Technology of Heat Sink Assisted Chip on Thick Film Substrate

作　　者：吕晓云 叶晓飞 黄栋 席亚莉 史凤 司艳 张艳 LV Xiaoyun;YE Xiaofei;HUANG Dong;XI Yali;SHI Feng;SI Yan;ZHANG Yan(Xi’an Microelectronics Technology Institution,Xi’an 710100,China)

机构地区：[1]西安微电子技术研究所,西安710100

出　　处：《电子工艺技术》2022年第6期342-344,353,共4页Electronics Process Technology

摘　　要：借助Flotherm计算仿真和热红外成像技术,探究厚膜混合集成电路中厚膜基板上金属热沉辅助功率芯片焊接技术的可行性。研究表明,在厚膜基板上使用金属热沉辅助芯片焊接后可以将芯片和基板的结壳热阻降低20%以上,热阻降低的多少主要与热沉材料的材料类型、热沉尺寸有关。经过工艺可靠性验证,目前市面上MoCu热沉材料(Mo70Cu30和Mo80Cu20)可以满足厚膜混合集成电路厚膜基板上的焊接可靠性需求,而具体选用的热沉材料和尺寸需要综合考虑材料的兼容性和产品可靠性。The feasibility of metal heat sink to assist chip soldering technology on thick film substrate in thick film hybrid integrated circuit are explored with the help of Flotherm computational simulation and thermal infrared imaging technology.The research shows that the thermal resistance of chip and substrate can be reduced by more than 20%after using metal heat sink to assist chip soldering on thick film substrate.The reduction of thermal resistance is mainly related to the material type and size of heat sink material.After process reliability verification,heat sink materials on the market(Mo70Cu30 and Mo80Cu20)can meet the soldering reliability on thick film substrate in thick film hybrid integrated circuit.The final selection requires a combination of material compatibility and product reliability.

关 键 词：厚膜混合集成电路 热沉辅助 焊接可靠性 

分 类 号：TN405[电子电信—微电子学与固体电子学]