雷达T/R组件气密封装研究  

A Study on Hermetic Package of Radar T/R Module

作　　者：赵希芳[1] 肖瑞[1] 马永林 ZHAO Xifang;XIAO Rui;MA Yonglin(Nanjing Research Institute of Electronics Technology,Nanjing 210039,China;The Unit 31001 of PLA,Beijing 100095,China)

机构地区：[1]南京电子技术研究所,南京210039 [2]解放军31001部队,北京100095

出　　处：《现代雷达》2022年第10期78-81,共4页Modern Radar

摘　　要：对雷达T/R组件进行气密封装是提高组件可靠性进而提高相控阵雷达长期使用可靠性的重要手段。针对雷达T/R组件气密封装可靠性要求高的问题,文中结合气密封装组件的组成,对气密封装设计中的封装壳体材料选择、壳体结构设计和封装工艺设计进行了系统分析和讨论。论证表明,选择与基板陶瓷材料热膨胀系数匹配的壳体材料、结合封装焊接工艺设计优化壳体结构、充分并合理进行试验验证是解决组件气密封装问题的关键。文中还就典型T/R组件的气密封装设计进行了举例说明。The hermetic package design of T/R module is an important means to improve the reliability of modules, thus improving the reliability of long-tern use of the phased array radar. Combined with the internal compositions in T/R modules which are made by hermetic package, the material selection of packaging shell, structure design and packaging process are systematically analyzed and discussed in this paper. Selecting shell material matching thermal expansion coefficient of matrix ceramic material, optimizing shell structure combined with packaging and welding process design, fully and reasonably carrying out test verification are the key to solve the problem of hermetic package of modules. At the same time, examples are given to illustrate the hermetic package design of T/R modules.

关 键 词：T/R组件 气密封装 结构设计 工艺 

分 类 号：TN957.3[电子电信—信号与信息处理]