电子封装用Sn-Ag-Cu低银无铅钎料研究进展及发展趋势  

Research Progress and Prospect of Low-Ag Lead-free Sn-Ag-Cu Solder in Electronic Packaging

作　　者：卢晓 张亮 王曦 李木兰 LU Xiao;ZHANG Liang;WANG Xi;LI Mu-lan(School of Mechatronic Engineering,Jiangsu Normal University,Jiangsu Xuzhou 221116,China)

机构地区：[1]江苏师范大学机电工程学院,江苏徐州221116

出　　处：《包装工程》2022年第23期118-136,共19页Packaging Engineering

基　　金：江苏省自然科学基金(BK20211351)。

摘　　要：目的为了适应高银钎料向低银钎料转变的发展趋势,综述近年来对低银SnAgCu钎料的最新研究,展示其在电子封装材料领域中宽广的应用前景。方法通过分析国内外有关低银钎料的研究成果,详细介绍合金化和颗粒强化等方法对低银钎料熔化特性、润湿性、显微结构、界面组织、力学性能的影响,重点总结元素掺杂的最佳添加量以及改性机理。结论通过添加金属元素、稀土元素、纳米颗粒,采用新型搅拌技术能有效提升钎料性能,部分改性后的低银复合钎料性能达到了高银钎料性能水平。The work aims to review the latest research on low-Ag Sn-Ag-Cu solder in recent years to demonstrate its broad application prospects in the field of electronic packaging materials,so as to meet the development trend of high-Ag solder to low-Ag solder.Through the analysis on the research results of low-Ag solder at home and abroad,the effects of alloying and particle strengthening on the melting characteristics,wettability,microstructure,interface structure and mechanical properties of low-Ag solder were introduced in detail.The optimum addition amount of element doping and the modification mechanism were summarized.As a result,by adding metal elements,rare earth elements and nanoparticles,the new stirring technology can effectively improve the properties of the solder.The properties of partially modified low-Ag composite solder reach the level of high-Ag solder.

关 键 词：电子封装 低银钎料 显微组织 纳米颗粒 

分 类 号：TG425[金属学及工艺—焊接]