基于三维集成电路带扰流微通道散热特性分析  

Analysis of Heat Dissipation Characteristics of Microchannel with Disturbance Based on 3D Integrated Circuits

作　　者：江美霞 龚俭龙 JIANG Mei-xia;GONG Jian-long(School of Information Engineering,Guangzhou City Polytechnic,Guangzhou 510405,China;School of Mechanical and Electrical Engineering,Guangdong Communication Polytechnic,Guangzhou 510800,China)

机构地区：[1]广州城市职业学院信息工程学院,广东广州510405 [2]广东交通职业技术学院机电工程学院,广东广州510800

出　　处：《广州城市职业学院学报》2022年第4期80-84,共5页Journal Of Guangzhou City Polytechnic

基　　金：2020年度广东省普通高校青年创新人才项目“多热源耦合场下三维集成电路热设计和热管理技术研究”(编号:2020KQNCX199);广州市教育局2020年高校科研项目“基于集成微通道和硅通孔冷却的三维集成电路热特性研究”(编号:202032765);2021年度广州市教育科学规划“‘互联网’新形态下物联网专业群课程发展性评价体系研究”(编号:202113682)。

摘　　要：研究了三维集成电路微通道热沉传热特性,在开放式矩形微通道热沉结构中加入了矩形扰流柱,以改善其传热性能,利用ANSYS Fluent软件对三维集成电路微通道热沉的层流流动和耦合传热方程进行数值计算。实验结果表明,与开放式矩形微通道热沉结构对比,带矩形扰流柱的微通道热沉有着更加良好的传热性能。In this paper,the heat transfer characteristics of the three⁃dimensional integrated circuit microchannel heat sink were studied.The rectangular spoiler column was added to the open rectangular microchannel heat sink structure to improve its heat transfer performance.The laminar flow and coupled heat transfer equations of the three⁃dimensional integrated circuit microchannel heat sink were numerically calculated by using ANSYS Fluent software.The experimental results showed that compared with the open rectangular microchannel heat sink,the microchannel heat sink with rectangular pin fin had better heat transfer performance.

关 键 词：三维集成电路 微通道热沉 传热特性 扰流结构 

分 类 号：TN409[电子电信—微电子学与固体电子学]