铝合金无氰电刷镀铜/银及其性能  

Electro-brush plating of Cu/Ag on aluminum alloy with cyanide-free baths and properties of the coatings

作　　者：索帅 杜宝帅 李文 王广川 步衍江 张鲁宁 邹勇[2] 杨东旭 刘爽 SUO Shuai;DU Baoshuai;LI Wen;WANG Guangchuan;BU Yanjiang;ZHANG Luning;ZOU Yong;YANG Dongxu;LIU Shuang(State Grid Shandong Electric Power Research Institute,Ji’nan 250002,China;Shandong University,Ji’nan 250100,China)

机构地区：[1]国网山东省电力公司电力科学研究院,山东济南250002 [2]山东大学,山东济南250100

出　　处：《电镀与涂饰》2022年第23期1652-1655,共4页Electroplating & Finishing

基　　金：国网山东省电力公司科技项目(520626210020)。

摘　　要：采用无氰体系镀液先后在铝合金基体表面电刷镀Cu和Ag,分析了Cu/Ag镀层的外观、微观形貌、厚度、显微硬度、电导率和结合力。结果表明,电刷镀所得Cu/Ag为乳白色,表面平整,微观上呈花椰菜结构,结合力良好,其中Ag层厚度为50μm,显微硬度为112.4 HV,电导率为16.915 MS/m。Copper and silver were deposited successively by electro-brush plating on aluminum alloy substrate with cyanide-free baths.The appearance,micromorphology,thickness,microhardness,conductivity,and adhesion of the Cu/Ag coating were analyzed.The results showed that the electro-brush plated Cu/Ag coating was milky white,smooth,and well-adhered to the substrate with a cauliflower-like microstructure,where the silver coating was 50μm thick and had a microhardness of 112.4 HV and a conductivity of 16.915 MS/m.

关 键 词：铝合金 电刷镀 铜 银 无氰镀液 微观形貌 结合力 电导率 

分 类 号：TQ153.14[化学工程—电化学工业] TQ153.16