巯基乙酸对电解铜箔抗氧化性的影响  

Effect of thioglycolic acid on antioxidation of electrolytic copper foil

作　　者：华天宇 王世颖[1] 王文昌[1,2] 明小强 王朋举 HUA Tianyu;WANG Shiying;WANG Wenchang;MING Xiaoqiang;WANG Pengju(School of Materials Science&Engineering,Changzhou University,Changzhou 213164,China;School of Petrochemical Engineering,Changzhou University,Changzhou 213164,China;Jiangsu Mingfeng Electronic Material Technology Co.,Ltd.,Changzhou 213341,China)

机构地区：[1]常州大学材料与科学工程学院,江苏常州213164 [2]常州大学石油化工学院,江苏常州213164 [3]江苏铭丰电子材料科技有限公司,江苏常州213341

出　　处：《电镀与涂饰》2022年第23期1668-1675,共8页Electroplating & Finishing

摘　　要：将铜箔浸渍于巯基乙酸(TGA)中,利用TGA分子的吸附作用在铜箔表面构筑一层致密的防氧化膜。通过高温氧化试验和电化学测试研究了TGA体积分数对吸附膜层在140℃高温下及3.5%NaCl溶液中的抗氧化性。通过Materials Studio软件模拟分析了TGA分子在Cu(111)面的吸附行为,确定了TGA分子的吸附状态和全局反应活性。结果表明,TGA膜层能有效抑制铜箔的氧化变色,当TGA体积分数为0.05%时膜层的抗氧化性最佳。TGA在铜箔表面的吸附符合Langmuir单层吸附模型。TGA通过其亲电中心S原子提供电子与铜形成配位,从而垂直吸附在Cu(111)表面。A compact and antioxidative film was formed on the surface of copper foil through the adsorption of thioglycolic acid(TGA)by immersing copper foil into an solution containing TGA.The antioxidation performance of the film at 140°C and in 3.5%NaCl solution was studied by high-temperature oxidation test and electrochemical measurements.The adsorption state and global reactivity of TGA molecule were determined through analyzing the adsorption behavior of TGA molecule to Cu(111)plane by simulation with Materials Studio software.The results showed that the antioxidative film could inhibit the tarnishing of copper foil effectively.The film formed from a 0.05%(volume fraction)TGA solution had the best antioxidation performance.The adsorption of TGA to the surface of copper foil was consistent with the Langmuir’s monolayer adsorption model.TGA adsorbs to the Cu(111)plane vertically because S atom,the electrophilic center of TGA,offers electrons for the coordination between TGA and copper.

关 键 词：铜箔 巯基乙酸 抗氧化 吸附 量子化学计算 模拟分析 

分 类 号：TQ153.14[化学工程—电化学工业]