低温共烧陶瓷(LTCC)用电极银浆研究进展  

Research progress on silver paste for low temperature co-fired ceramics(LTCC)application

作　　者：高于珺 冯静静 刘峰[1] 张发强[1] 马名生[1] 刘志甫[1,2] GAO Yujun;FENG Jingjing;LIU Feng;ZHANG Faqiang;MA Mingsheng;LIU Zhifu(CAS Key Lab of Inorganic Functional Materials and Devices,Shanghai Institute of Ceramics,Chinese Academy of Sciences,Shanghai 201899,China;Center of Materials Sciences and Optoelectronics Engineering,University of Chinese Academy of Sciences,Beijing 100049,China)

机构地区：[1]中国科学院上海硅酸盐研究所信息功能陶瓷材料与器件研究中心,上海201899 [2]中国科学院大学材料科学与光电工程中心,北京100049

出　　处：《电子元件与材料》2022年第11期1133-1142,共10页Electronic Components And Materials

基　　金：中国科学院科技服务网络计划(STS)区域重点项目(KFJ-STS-QYZD-2021-07-001);广东省重点研发计划(2020B010176001);中国博士后科学基金(2021M693264)。

摘　　要：低温共烧陶瓷(LTCC)用电极银浆涉及材料、化工、冶金、电子、流变学等多学科,是LTCC元器件、集成模块研制和生产必不可少的关键材料。总结了LTCC用电极银浆的组成及其组分设计原则,系统归纳了微波/毫米波应用对内、外、填孔银浆的性能需求,阐述了LTCC电极银浆印刷特性、共烧匹配性、电性能以及焊接性等的研究进展。最后指出了目前银浆存在的问题,并对其今后的研究方向进行了展望。Silver paste is an electronic functional material,which is related with materials,chemical engineering,metallurgy,electronics,rheology and other disciplines and widely used for Low Temperature Co-fired Ceramics(LTCC)electrodes.It is an essential key material for the development and production of LTCC components and integrated modules.This paper summarizes the composition and component design principles of the silver paste for LTCC.In addition,the performance requirements of internal,external and via-filled silver paste for microwave/millimeter wave applications are systematically summarized,and the research progress of screen-printing property,co-firing matching,electrical performance and weldability for LTCC silver paste is included.Finally,the existing problems of the silver paste are pointed out,and the future research trend is prospected.

关 键 词：LTCC 电极银浆 综述 丝网印刷 共烧匹配 电导率 

分 类 号：TB34[一般工业技术—材料科学与工程]