Microstructures and mechanical properties of Cu/Al compound materials during thermal cycle  

作　　者：Bing Wang Ping Liu Xin-Kuan Liu Zi-Yan Wang Yan-Yan Wang Xiao-Hong Chen Xiao-Zhi Liu 

机构地区：[1]School of Materials Science and Engineering,University of Shanghai for Science and Technology,Shanghai,200093,China [2]Automobiles Science and Technology(Shanghai)Co.,Ltd,Shanghai,200433,China

出　　处：《Rare Metals》2022年第11期3911-3918,共8页稀有金属（英文版）

基　　金：financially supported by the National Natural Science Foundation of China(No.51201107)。

摘　　要：Cu/Al compound materials,named as copperclad aluminum bus bars,are widely used in heat dissipation of modern engineering.The thermal cycle tests were conducted at 200,250 and 300℃for different cycle times,respectively.Effects of thermal cycle temperatures and thermal cycle times on micro structures and mechanical properties of the interface were studied.The results show that the width of bonding layer and bond strength are significantly affected by thermal cycle temperatures and times.Nonetheless,the variety or the quantity of intermediate compounds is scarcely influenced.Al_(2)Cu,Cu_(9) Al_(4)and CuAl were identified on the interface.With the increase in cycle times,grains of the material grew up.However,grains of the interface grew up more apparently than those of Cu and Al.The knowledge may be applied in the establishment of service condition and quality evaluation of material.

关 键 词：Copper-clad aluminum bus bars Thermal cycle Interface BONDING Microstructure INTERMETALLIC 

分 类 号：TB331[一般工业技术—材料科学与工程]