CLGA封装器件高可靠性装联工艺研究  

High Reliability Assembly Process of CLGA Packaged Devices

作　　者：张昧藏 徐伟玲[1] 权亮 赵亚娜 杨瑞栋 ZHANG Meicang;XU Weiling;QUAN Liang;ZHAO Yana;YANG Ruidong(Beijing Institute of Space Mechanics and Electricity,Beijing 100089)

机构地区：[1]北京空间机电研究所,北京100089

出　　处：《宇航材料工艺》2022年第6期71-76,共6页Aerospace Materials & Technology

摘　　要：为了保证陶瓷栅格阵列(CLGA)封装器件装联可靠性,本文以CLGA封装器件为研究对象,采用Pb90Sn10焊球、Pb90Sn10与Pb80Sn20焊柱、Be-Cu/Sn60Pb40微弹簧圈(MCS)和Sn63Pb37共晶焊料,实现了对CLGA封装器件的二次工艺设计,并采用回流焊工艺方法将器件装联在印制电路板上。通过有限元分析及试验相结合的方法,探索了适用于此类器件的高可靠性装联工艺。对3种元器件建立有限元仿真模型来模拟应力应变情况,同时对印制板组件进行了力学、热学实验分析。结果表明,仿真发现弹簧所受的应力和应变最小,焊柱其次,焊球最大;试验验证与仿真结果相符,植弹簧的器件可靠性最高,植焊柱的其次,植焊球的最差;500个温度循环与振动试验表明植弹簧器件无裂纹,植焊柱、植焊球的器件出现裂纹,焊点金相剖切与SEM能谱显微组织分析均符合航天标准要求。植焊球、植焊柱的器件焊点断裂失效位置均出现在焊球、焊柱与钎料印制板接触的位置,且裂纹处金属间化合物(IMC)层厚度与能谱成分未见异常。In order to ensure the reliability of CLGA(Ceramic Land Grid Array)packaged devices,in this paper,secondary process design of the CLGA packaged devices were investigated by using PbSnsolder ball,PbSnand PbSnsolder column,and Be-Cu/SnPbMicro-Coil Spring(MCS)and SnPbeutectic solder paste to assemble the devices on the printed circuit board through reflow soldering process.Through combination of finite element analysis and test,a high reliability assembly process suitable for such devices was explored.The finite element simulation models were established for the three components to simulate the stress and strain level.Mechanical and thermal experiments of the printed board assemblies were carried out.The simulation found minimum stress and strain in the micro-coil spring,lower stress and strain in the solder column,and maximum stress and strain in the solder ball.The research showed that the experimental verification was consistent with simulation results.The attaching Micro-Coil Spring devices had the highest reliability,whilst the attaching solder column devices had lower reliability,and the attaching solder ball devices had the worst.There were no cracks in the attaching micro-coil spring devices after 500 thermal cycles and vibration test.But some cracks appeared in the attaching solder column devices and the attaching solder ball devices.Solder joint metallographic microsection and SEM energy spectrum microstructure analysis met the requirements of aerospace standard.The fracture failure positions of the attaching solder ball and the attaching solder column devices all appeared in the touching position between the solder ball,the solder column and the printed circuit board.The thickness of the intermetallic compounds(IMC)layer and energy spectrum composition at the crack were normal.

关 键 词：陶瓷栅格阵列 植球 植柱 植弹簧 高可靠性 

分 类 号：TN605[电子电信—电路与系统]