三维集成微波组件技术:进展与展望  

Technologies of Three-dimensional Integrated Microwave Module:Advances and Prospects

作　　者：黄建[1] HUANG Jian(Southwest China Institute of Electronic Technology,Chengdu 610036,China)

机构地区：[1]中国西南电子技术研究所,成都610036

出　　处：《电讯技术》2023年第1期137-144,共8页Telecommunication Engineering

摘　　要：介绍了三维集成微波组件的典型集成架构及其特点,综述了三维集成微波组件基板技术、垂直互连及热设计等关键技术研究现状,对主要技术性能进行了对比分析。介绍了三维集成微波组件可靠性理论与技术研究进展及后续研究方向。分析了三维集成微波组件技术发展趋势,提出了重点技术攻关方向建议,并对三维集成微波组件技术发展和应用前景进行了预测。The typical integration architectures as well as their features of three-dimensional integrated microwave modules are introduced.The research states of key technologies including substrates,vertical interconnections and thermology design are reviewed.The performances of each technology approaches are compared.The reported and successive research works about theories and technologies of reliability are introduced.The technical development trends are analyzed and the preferred directions of technical breakthrough are proposed.The prospects of technical developments and applications are predicted.

关 键 词：三维集成 微波组件 异质集成 垂直互连 应用前景 

分 类 号：TN40[电子电信—微电子学与固体电子学]