MPCVD多晶金刚石片的研磨均匀性分析  

Analysis on the lapping uniformity of MPCVD polycrystalline diamond wafer

作　　者：徐钰淳 朱建辉 王宁昌 师超钰 赵延军 邵俊永 徐帅 XU Yuchun;ZHU Jianhui;WANG Ningchang;SHI Chaoyu;ZHAO Yanjun;SHAO Junyong;XU Shuai(State Key Laboratory of Superabrasives,Zhengzhou 450001,China;Zhengzhou Research Institute for Abrasives&Grinding Co.,Ltd,Zhengzhou 450001,China)

机构地区：[1]超硬材料磨具国家重点实验室,郑州450001 [2]郑州磨料磨具磨削研究所有限公司,郑州450001

出　　处：《金刚石与磨料磨具工程》2022年第6期705-712,共8页Diamond & Abrasives Engineering

基　　金：河南省重大科技专项(221100230300);河南省科技攻关项目(222102230043);郑州市重大科技创新专项(2021KJZX0062)。

摘　　要：在游离磨料研磨过程中,研磨的驱动方式及工艺参数等直接影响加工后工件的平面度和表面粗糙度。为了探究基于旋摆式驱动的游离磨料研磨工艺参数对MPCVD多晶金刚石片平整化的影响,建立旋摆式驱动平面研磨过程中的单磨粒运动学模型,根据实际研磨过程采用多磨粒随机分布模型进行计算机仿真计算,引入多磨粒轨迹的均匀性离散系数对磨粒轨迹均匀性进行分析。结果表明:当转速比取值等于0.5时,磨粒轨迹离散系数最大;当转速比小于等于0.5时,离散系数与转速比为正相关;研磨盘摆动弧线的弦长大于金刚石片直径时,磨粒相对于整个金刚石片表面的运动轨迹分布较为均匀;计算机仿真计算得到了研磨最优参数,并通过2英寸MPCVD多晶金刚石片研磨试验验证了仿真结果的有效性。研磨后金刚石片表面PV值为2.4μm,表面粗糙度Ra达到139 nm,材料去除率dMRR为10.1μm/h。In the process of free abrasive lapping, the driving mode and process parameters directly affect the flatness and surface roughness of the workpiece. To explore the effect of free abrasive lapping process parameters based on rotary swing drive on the planarization of MPCVD polycrystalline diamond film, a kinematic model of single abrasive grain in rotary swing drive plane lapping process was established in this study. According to the actual lapping process,this paper adopts the multi-abrasive random distribution model for computer simulation and introduces the uniformity dispersion coefficient of multi-abrasive trajectory to analyze the diamond surface abrasive trajectory. The results suggest that when the speed ratio equals 0.5, the dispersion coefficient of abrasive trajectory is the largest;when the speed ratio is less than or equals 0.5, the dispersion coefficient of abrasive trajectory is positively correlated with the speed ratio;and when the length of the swing arc chord of the lapping workpiece disc is larger than the diameter of the diamond film, the motion trajectory of the abrasive particles relative to the whole diamond film surface is evenly distributed. The optimal lapping parameters are obtained by computer simulation. Through the 2 inch polycrystalline diamond lapping test, the final surface PV value of diamond is 2.4 μm, the surface roughness Ra is 139 nm and the material removal rate d MRR is 10.1 μm/h.

关 键 词：旋摆式驱动 多晶金刚石片 平面研磨 磨粒轨迹 面形精度 材料去除率 

分 类 号：TG74[金属学及工艺—刀具与模具] TQ164[化学工程—高温制品工业]