磁控溅射后的铂靶表面形貌分析  

Surface morphology analysis of platinum targets during magnetron sputtering

作　　者：李思勰 闻明[1] 管伟明[1] 沈月[1] 王传军[1] LI Si-xie;WEN Ming;GUAN Wei-ming;SHEN Yue;WANG Chuan-jun(Kunming Institute of Precious Metals,Yunnan Precious Metals Laboratory Co.Ltd.,Kunming 650106,China)

机构地区：[1]昆明贵金属研究所云南贵金属实验室有限公司,昆明650106

出　　处：《贵金属》2022年第4期19-23,共5页Precious Metals

基　　金：云南贵金属实验室科技计划(YPML-2022050217);云南省科技科技计划项目中央引导地方科技发展资金计划(202207AA 110009);国家重点研发计划(2017YFB0305503);云南省国际合作计划(2014IA037);云南省创新团队项目(2019HC024)。

摘　　要：通过分析磁控溅射沉积镀膜后的靶材表面形貌及金相组织,探究了磁控溅射过程中靶材表面的变化趋势。采用场发射扫描电镜观察了磁控溅射后铂靶材表面形貌,采用共聚焦显微镜观察了靶材金相组织。结果表明,靶材的溅射表面形貌呈现规律性变化。靶材中心部位因靶原子反向沉积(反溅)而呈现松散的团簇状聚集形貌;在靶材溅射刻蚀程度较高的部位则呈现明显的凹凸不平状态;随溅射刻蚀程度逐渐降低,靶材边缘处呈现较为平缓的凹凸形貌。此外,靶材溅射面因获得入射离子的部分能量而造成局部升温,晶粒再结晶生长,导致靶材溅射表面的晶粒尺寸要大于靶材芯部。By using field emission scanning electron microscope and confocal microscope,the changes in the surface morphology and metallographic structure of the platinum targets during magnetron sputtering were investigated.The results showed that the sputtering surface morphology varied regularly.The central part of the target presented a loose cluster-like aggregation due to the redeposition of platinum atoms.For the part with a high degree of sputtering of the target,obvious uneven morphology was observed.With the gradual reduce in degree of sputtering,the edge of the target displayed a relatively gentle concave-convex morphology.In addition,local temperatures in the sputtering surface rose because of the energy of the incident ions,leading to the recrystallization and growth of grains.As a result,the grain size of sputtering surface was larger than that of the target core.

关 键 词：金属材料 磁控溅射 铂靶材 表面形貌 晶粒 

分 类 号：TG146.3[一般工业技术—材料科学与工程]