无铅焊料合金研究现状  

Research Status on Lead-free Solder Alloy

作　　者：吕金梅 陈希 卢红波 孙维 张欣 LYU Jin-mei;CHEN Xi;LU Hong-bo;SUN Wei;ZHANG Xin(Yunnan Tin Industry Tin Material Co.,Ltd.,Kunming,Yunnan 650501,China)

机构地区：[1]云南锡业锡材有限公司,云南昆明650501

出　　处：《云南冶金》2022年第6期99-105,共7页Yunnan Metallurgy

基　　金：云南省高层次科技人才及创新团队选拔专项-创新团队项目(202105AE160028)。

摘　　要：介绍了目前广泛使用的无铅焊料体系及其优缺点,在Sn-Cu、Sn-Ag、Sn-Bi、Sn-Zn系无铅焊料合金与SnPb37合金性能进行对比的基础上,通过焊接界面IMC可靠性分析,总结了金属元素、纳米颗粒对无铅焊料合金可靠性能的影响,对Thermo-Calc计算在焊料合金设计和疲劳计算的应用前景和发展趋势进行了展望。The widely used lead-free solder system and its advantages and disadvantages were introduced, the addition type and its suitable range of some trace elements were summarized, the stable influencing factors were discussed, and the calculation situation of Thermo-Calc was summarized too.

关 键 词：无铅焊料 掺杂 可靠性 Thermo-Calc计算模拟 

分 类 号：TD421[矿业工程—矿山机电]