金丝在镀银铜支架上的键合性能研究  

Bondability of gold wire on Ag plated Cu lead frame

作　　者：肖雨辰 吴保安 唐会毅 栾佰峰[2] 谭骁洪 杨晓玲 蔡欣男 谢勇 孙玲 李凤 XIAO Yuchen;WU Baoan;TANG Huiyi;LUAN Baifeng;TAN Xiaohong;YANG Xiaoling;CAI Xinnan;XIE Yong;SUN Ling;LI Feng(Chongqing Materials Research Institute Co.,Ltd.,Chongqing 400707,China;School of Materials Science and Engineering,Chongqing University,Chongqing 400044,China;Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp,Chongqing 400030,China)

机构地区：[1]重庆材料研究院有限公司,重庆400707 [2]重庆大学材料科学与工程学院,重庆400044 [3]中国电子科技集团公司第二十四研究所,重庆400030

出　　处：《功能材料》2023年第1期1138-1143,共6页Journal of Functional Materials

基　　金：“科技助力经济2020”重点专项(SQ2020YFF0426392);重庆市技术创新与应用发展专项重点项目(cstc2019jscx-mbdxX0009);重庆市自然科学基金博士后科学基金(cstc2020jcyj-bshX0087)。

摘　　要：键合金丝是电子封装过程中的关键材料,其键合可靠性对电子元器件的性能稳定性与寿命具有重要的影响。使用自制的Au丝将2835 LED芯片与镀Ag支架键合,并采用破坏性键合强度测试和加速寿命试验,测试并研究了Au丝的键合强度及Au-Ag键合界面的可靠性,通过扫描电镜(SEM)、电子探针(EPMA)等手段,对比分析了高温及电流加载对Au丝及Au-Ag键合界面组织演变及元素扩散行为的影响。研究结果表明,高温偏压寿命试验(TBOL)后,Au与Ag的相互扩散加剧,Au-Ag键合点残金面积增大,Au焊点中Ag含量从0.195%提高至1.584%(质量分数),使焊点固溶强化效应增强,焊点平均推力值增大约10%,进一步提高了焊点的键合可靠性。Bonding alloy wire is a key material in the process of electronic packaging.Itsbonding reliability has an important impact on the performance stability and operating life of electronic components.In this paper,2835 LED chips were bonded with Ag plated lead frames by Au wires,and the bonding strength of Au wires and the reliability of Au-Ag bonding interfaces were tested and studied by means of destructive bonding strength tests and accelerated life tests.The effects of high temperature and current loading on the microstructure evolution and element diffusion behavior of Au wires and Au-Ag bonding interfaces were compared and analyzed.The results show that after the temperature bias and operating life(TBOL)test,the mutual diffusion of Au and Ag has been intensified,and the residual gold area of Au-Ag bonding point has been increased.The Ag content in Au solder joint increased from 0.195%to 1.584%(mass fraction),which enhanced the solid solution strengthening effect of solder joint,and the average thrust value of solder joint has been increased by about 10%,which further improved the bonding reliability of solder joint.

关 键 词：电子封装 键合金丝 可靠性 元素扩散 

分 类 号：TB302[一般工业技术—材料科学与工程]