四阶交叉盲孔的埋阻电路板制造工艺分析  

Analysis of Manufacturing Process of Buried Resistor Circuit Board with Fourth Layer Cross Blind Holes

作　　者：吉祥书 JI Xiangshu(Zhejiang Wanzheng Electronic Technology Co.,Ltd.,Zhejiang 314107,China)

机构地区：[1]浙江万正电子科技股份有限公司,浙江314107

出　　处：《集成电路应用》2022年第12期29-31,共3页Application of IC

摘　　要：阐述两种传统的交叉盲孔制作方法的局限性,并在此基础上进一步优化,提出分层次制作盲孔(三盲一埋)、四次压合工艺、选择性三次背钻的新思路新方法。探讨三种工艺方法相结合,实现四阶交叉盲埋孔电路板的制作,同时满足四阶交叉盲埋孔的埋阻多层微波电路板加工成品后的各项性能指标及外观要求,符合国军标GJB362C-2021质量接收标准。This paper expounds the limitations of two traditional methods of making cross blind holes,and further optimizes them on this basis,and puts forward a new idea and method of making blind holes by layers(three blinds and one burying),four times pressing technology,and selective three times back drilling.It discusses the combination of three process methods to realize the production of four layer cross blind buried hole circuit board,and at the same time,it meets the performance indicators and appearance requirements of the finished product of the four layer cross blind buried hole buried multilayer microwave circuit board,and meets the quality acceptance standard of the national military standard GJB362C-2021.

关 键 词：印刷电路板 交叉盲孔 埋阻 盲埋孔 背钻 

分 类 号：TN915.08[电子电信—通信与信息系统]