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作 者:汪文强 蒋冬辉[1,2] WANG Wenqiang;JIANG Donghui(High Magnetic Field Laboratory,HFIPS,Chinese Academy of Science,Hefei 2303l,China;High Magnetic Field Laboratoryof Anhui Province,Hefei 23003l,China)
机构地区:[1]中国科学院合肥物质科学研究院强磁场科学中心,合肥230031 [2]强磁场安徽省实验室,合肥230031
出 处:《低温物理学报》2022年第4期285-295,共11页Low Temperature Physical Letters
基 金:国家自然科学基金(批准号:U2032217);强磁场安徽省实验室方向基金(批准号:AHHM-FX-2021-02)资助的课题.
摘 要:以YBa_(2)Cu_(3)O_(7)(YBCO)带材为代表的二代高温超导带材被广泛应用于各类超导装备中,由于YBCO超导带材生产长度的限制,其接头技术将在带材的实用化发展中起到至关重要的作用,其中低熔点焊料焊接接头技术由于其工艺简单且能够满足目前二代高温超导材料的应用需求,成为现阶段接头制备的主流技术.本文基于YBCO基本属性,结合目前国内外的YBCO带材生产现状,系统全面地调研了低熔点焊料焊接接头技术的制作工艺及其性能的影响因素,明确了低熔点焊料焊接接头的关键影响因素,梳理了二代高温超导带材接头的焊接工艺流程,为二代高温超导带材接头的制备提供参考。As a representative of Second-generation high temperature superconducting tape,YBa_(2)Cu_(3)O_(7)(YBCO)is widely used in numerous superconducting devices.The joint will play a vital role in the practical development of the tape.Low melting point solder welding joint technology has become the mainstream technology at this stage due to its simple process and can meet the application requirements of Second-generation high temperature superconducting materials.Based on the basic properties of YBCO,combined with the worldwide situation of YBCO tape production,this paper systematically investigates the manufacturing process of low melting point solder joint technology and its performance influencing factors,clarifies the key influencing factors of low melting point solder joints,and sorts out the welding process flow of the Second-generation high-temperature superconducting tape joints,which can provide reference for the manufacture preparation of Second-generation high temperature superconductingtapejoint.
分 类 号:TM26[一般工业技术—材料科学与工程]
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