MEMS封装中全Cu_(3)Sn焊点组织演变及剪切性能  

Microstructure Evolution and Shear Performance of Full Cu_(3)Sn Solder Joints in MEMS Packaging

作　　者：梁晓波 黄漫国[1,2] 刘德峰 高云端[1,2] 李欣 张鹏斐[1,2] LIANG Xiao-bo;HUANG Man-guo;LIU De-feng;GAO Yun-duan;LI Xin;ZHANG Peng-fei(AVIC Beijing Changcheng Aeronautical Measurement and Control Technology Research Institute,Beijing 101111,China;Aviation Key Laboratory of Science and Technology on Special Condition Monitoring Sensor Technology,Beijing 101111,China)

机构地区：[1]航空工业北京长城航空测控技术研究所,北京101111 [2]状态监测特种传感技术航空科技重点实验室,北京101111

出　　处：《测控技术》2023年第1期40-44,50,共6页Measurement & Control Technology

摘　　要：对Cu/Sn+Sn/Cu结构进行了低温键合,在不同的键合时间下制备焊点,分析了键合时间对焊点界面组织演变的影响和全Cu_(3)Sn焊点制备过程中界面反应机理,对焊点的剪切性能进行了分析和研究。结果表明,随着键合时间的增加,Cu_(6)Sn_(5)逐渐变成扇贝状并不断长大。键合时间达到90 min时,Sn完全被消耗,继续增加键合时间,Cu_(3)Sn以Cu_(6)Sn_(5)的消耗为代价不断长大,最终全部转变成Cu_(3)Sn。随着加载速率的增加,全Cu3Sn焊点的抗剪切强度值逐渐减小,焊点界面两侧Cu3Sn界面处沿晶断裂占焊点断裂模式的比例越来越大,因为这种沿晶断裂的抗剪切能力较小,所以焊点的抗剪切强度随着加载速率的增加而下降。The Cu/Sn+Sn/Cu structure is soldered in low temperature and joints are fabricated under different bonding time.The effects of different bonding time on the microstructure evolution at the interface and the interfacial reaction mechanism in the process of full IMC joints fabrication are analyzed.The shear performance of full Cu3Sn joined is studied.The results indicate that Sn is totally consumed with the bonding time reached 90 min.Continue to increase the soldering time, Cu_(3)Sn generally increases at the expense of Cu_(6)Sn_(5)consumption and Cu_(6)Sn_(5)totally transforms into Cu3Sn eventually.With the increase of loading rate, the shear strength of full Cu_(3)Sn joints decreases gradually.The proportion of the intergranular fracture of Cu3Sn boundary at both sides of joints is bigger and bigger with the increase of loading rate and the shear resistance of this intergranular fracture is low.Therefore, the shear strength of full Cu_(3)Sn joints decreases gradually with the increase of loading rate.

关 键 词：MEMS封装 全Cu_(3)Sn焊点 组织演变 剪切性能 

分 类 号：TH162[机械工程—机械制造及自动化]