氯盐体系印刷电路板电镀锡试验研究  

Electroplating of Tin on Printed Circuit Board in Chloride System

作　　者：唐施阳 杨建广 李陵晨 南天翔 唐朝波 TANG Shiyang;YANG Jianguang;LI Lingchen;NAN Tianxiang;TANG Chaobo(School of Metallurgy and Environmental,Central South University,Changsha 410083,China)

机构地区：[1]中南大学冶金与环境学院,湖南长沙410083

出　　处：《湿法冶金》2023年第1期83-89,共7页Hydrometallurgy of China

基　　金：湖南省高新技术产业科技创新引领计划项目(2021GK4004)。

摘　　要：研究了用氯盐体系在印刷电路板(PCB板)上电镀锡,考察了相关因素对电镀锡的影响,确定了最佳工艺条件。结果表明:在温度35℃、Sn^(2+)质量浓度40 g/L、电流密度2 A/dm^(2)、盐酸浓度3 mol/L、镀锡时间6 min最佳条件下制得的锡镀层表面光亮平整且无裂缝裂纹;镀液中添加1 g/L的抗坏血酸可有效提高镀液稳定性;镀层和基体之间结合力良好,符合PCB制作过程中的要求。Tin electroplating on printed circuit board(PCB) by chlorine salt system was studied.The effects of related factors on tin electroplating was investigated and the optimum technological conditions were determined.The results show that under the optimal conditions of temperature of 35 ℃,Sn^(2+)mass concentration of 40 g/L,current density of 2 A/dm^(2),hydrochloric acid concentration of 3 mol/L and electroplating time of 6 min, the tin coating surface is smooth and bright without cracks.Adding 1 g/L ascorbic acid can effectively improve the stability of the electroplating solution.The adhesion between the coating and the substrate is good.The tin layer achieves the requirements of PCB fabrication.

关 键 词：PCB板 电镀 锡 氯盐体系 锡镀层 

分 类 号：TQ153.13[化学工程—电化学工业]