一种镀铜预塑封封装载体结构  

Design and research on copper plating and pre-mold leadframe

作　　者：潘效飞 沈堂芹 PAN Xiao-fei;SHEN Tang-qin(Wuxi China Resources Micro-assembly Technology Co.,Ltd)

机构地区：[1]无锡华润安盛科技有限公司

出　　处：《中国集成电路》2023年第1期78-81,共4页China lntegrated Circuit

摘　　要：封装载体是用来在封装组装过程中支撑芯片、提供芯片和外部的电气连接。近年来随着5G、新能源汽车、数字货币等高端电子行业的发展,传统的封装载体引线框架和基板由于工艺局限和材料影响导致封装尺寸偏大、可靠性降低。因此业界开发了镀铜预塑封框架。本文介绍了镀铜预塑封框架技术的工艺流程和结构、材料特性和可靠性,并分析了未来的发展。The assembly carrier is used to support the chip,provide the chip and the external electrical connection during the assembly process.In recent years,with the development of high-end electronic industry such as 5G,new energy automobile,digital cash,the traditional assembly carrier lead frame and substrate are larger in package size and lower in reliability because of the technology limitation and material influence.Therefore,the industry has developed a copper-plated pre-mold leadframe.The process flow and structure,material characteristics,reliability improvement of copper plating pre-mold leadframe technology are introduced.The future development is analyzed.

关 键 词：镀铜 预塑封 环氧树脂 铜柱 热膨胀系数 嵌入式模块 

分 类 号：TN405[电子电信—微电子学与固体电子学] TB30[一般工业技术—材料科学与工程]