高可靠产品清洗工艺及设备综述  

Summary of Cleaning Process and Equipment Relate to the Products Requiring High Reliability

作　　者：吴民[1,2] 李福勇 蒋庆磊 WU Min;LI Fuyong;JIANG Qinglei(The 14th Research Institute of CETC,Nanjing 210039,China;Nanjing Glarun Microwave Devices Co.,ltd.,Nanjing 210000,China)

机构地区：[1]中国电子科技集团公司第十四研究所,南京210039 [2]南京国睿微波器件有限公司,南京210000

出　　处：《电子工艺技术》2023年第1期1-5,45,共6页Electronics Process Technology

基　　金：装备预先研究重点基金项目(61404130404)。

摘　　要：以免清洗工艺和一个产品失效案例为开端,介绍了国内外相关标准对高可靠产品清洗的要求。主要讨论清洗工艺及设备,阐述了助焊剂的成分及反应机理、清洗原理与溶剂、清洗设备和工艺参数,最后探讨了清洗设备的趋势。Starting with no-clean technology and a failure case, the requirements of cleaning in national and international standards which relate to the products requiring high reliability is introduced. The cleaning process and equipment are mainly discussed, the elements and reaction mechanism of flux, the principle of cleaning and solvent, cleaning equipment and process parameters are illustrated, and the trend of the development of the cleaning equipment is discussed at last.

关 键 词：免洗助焊剂 相似相溶原理 极性分子 非极性分子 离子污染 蒸馏 

分 类 号：TN605[电子电信—电路与系统]