某型倒装焊结构FPGA器件失效模式分析  

Failure Mode Analysis of FPGA Device with Flip Chip

作　　者：吴双 余治民 王中一 姚长虹[1] 刘林发[1] WU Shuang;YU Zhimin;WANG Zhongyi;YAO Changhong;LIU Linfa(China Airborne Missile Academy,Luoyang 471009,China;The First Military Representative Offi ce of Air Cargo in Luoyang,Luoyang 471009,China)

机构地区：[1]中国空空导弹研究院,河南洛阳471009 [2]空装驻洛阳地区第一军事代表室,河南洛阳471009

出　　处：《电子工艺技术》2023年第1期37-40,共4页Electronics Process Technology

摘　　要：某型现场可编程门阵列器件(FPGA)内部含有倒装芯片。由于其典型的塑封BGA结构,该器件在生产过程中的固有合格率较低,频发各类质量问题。经过多次故障攻关,分析该类FPGA器件设计、使用、结构,采取对应改进措施,提高了使用合格率。最后对其失效模式及改进措施进行分析总结,对同类器件的同类故障提供一定的改进参考。A certain type of field programmable gate array device contains flip chip inside. Due to its typical plastic BGA structure, the inherent qualifi cation rate of the device in the production process is low,and various quality problems occur frequently. After many fault tackling, the design, use and structure of this FPGA device are analyzed, and corresponding improvement measures are taken to improve the use qualification rate. Finally, the failure modes and improvement measures are analyzed and summarized,providing some improvement reference for the similar failures of similar devices.

关 键 词：FPGA PBGA 失效分析 改进 固有合格率 

分 类 号：TN305[电子电信—物理电子学]