化学镀镍钯金电路板金丝键合可靠性分析  

Reliability Analysis of Gold Wire Bonding on ENEPIG PCB

作　　者：张路非 闫军政 刘理想 王芝兵 吴美丽 李毅 ZHANG Lufei;YAN Junzheng;LIU Lixiang;WANG Zhibing;WU Meili;LI Yi(Guizhou Zhenhua Qunying Electric Appliance Co.,Ltd.,Guiyang 550000,China)

机构地区：[1]贵州振华群英电器有限公司,贵阳550000

出　　处：《电子工艺技术》2023年第1期46-49,共4页Electronics Process Technology

摘　　要：在微组装工艺应用领域,为保证印制电路板上裸芯片键合后的产品可靠性,采用化学镀镍钯金工艺(ENEPIG),可在焊接时避免“金脆”问题、金丝键合时避免“黑焊盘”问题。针对化学镀镍钯金电路板的金丝键合(球焊)可靠性进行了研究,从破坏性键合拉力测试、第一键合点剪切力测试以及通过加热条件下的加速材料扩散试验、键合点切片分析、键合点内部元素扫描等多方面分析,与常规应用的镀镍金基板键合强度进行了相关参数对比,最终确认了长期可靠性满足产品生产要求。此外,对镍钯金电路板金丝键合应用过程中需要注意的相关事项进行了总结与说明。In the field of micro assembly process application, in order to ensure the product reliability of bare chips after bonding on printed circuit board, the use of ENEPIG can avoid the "gold brittleness" problem during soldering and the "black pad" problem during gold wire bonding. The reliability of gold wire bonding(ball bonding) of ENEPIG circuit board is studied. The bonding strength of ENEPIG circuit board is compared with that of conventional nickel plated gold substrate through destructive bonding tension test,shear force test at the first bonding point, accelerated material diffusion test under heating conditions, bond point slicing analysis, and element scanning inside the bond point. Finally, it is confirmed that the long-term reliability meets the production requirements. In addition, the matters needing attention in the application of nickel palladium circuit board gold wire bonding are summarized and explained.

关 键 词：印制电路板 化学镀镍钯金 金丝键合 可靠性 

分 类 号：TN605[电子电信—电路与系统]