基于焊接数据分析的平行缝焊缺陷检测方法  

Parallel Seam Welding Defect Detection Based on Welding Data Analysis

作　　者：王伟乾 张慧俊 白晋铭 WANG Weiqian;ZHANG Huijun;BAI Jinming(The 2th Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2023年第1期57-60,共4页Electronics Process Technology

摘　　要：平行缝焊是一种用于对露点和气密性要求较高的微电子单片集成电路管壳进行气密性封装的封装工艺。影响缝焊质量的因素有很多,因此有多种针对平行缝焊缺陷检测的手段,通常是经过显微镜目检,氦质谱检漏和氟油粗检三种检测方式。通过对不同焊接问题反馈的焊接数据进行数据分析,提出一种基于焊接数据分析的平行缝焊缺陷检测,可以有效提高缺陷检测的准确率和效率。Parallel seam welding is a kind of packaging process for hermetic packaging of microelectronic monolithic integrated circuit shell with high requirements for dew point and air tightness. There are many factors that affect the quality of seam welding, so there are a variety of methods to detect the defects of parallel seam welding, usually through visual inspection by microscope, helium mass spectrometry leak detection and fluorine oil inspection. Based on the analysis of welding data from different welding problems,a parallel seam welding defect detection method based on welding data analysis is proposed, which can effectively improve the accuracy and efficiency of defect detection.

关 键 词：平行缝焊 焊接数据分析 缺陷检测 

分 类 号：TN606[电子电信—电路与系统]