CuO修饰CeO2纳米复合磨料的制备及抛光性能  

Preparation and Polishing Properties of CuO-modified CeO2 Nanocomposite Abrasives

作　　者：孙加营 方杨飞 张一波 刘秋文[2] 刘凯杰 杨向光 SUN Jiaying;FANG Yangfei;ZHANG Yibo;LIU Qiuwen;LIU Kaijie;YANG Xiangguang(School of Rare Earths,University of Science and Technology of China,Hefei 230026,China;Ganjiang Innovation Academy,Chinese Academy of Sciences,Ganzhou 341000,Jiangxi,China)

机构地区：[1]中国科学技术大学稀土学院,合肥230026 [2]中国科学院赣江创新研究院,江西赣州341000

出　　处：《材料导报》2023年第3期110-114,共5页Materials Reports

基　　金：中国科学院青年创新促进会人才项目(2018263);中国科学院重点部署项目(ZDRW-CN-2021-3);中国科学院赣江创新研究院自主部署项目(E055C003);江西省双千计划(青年)项目(jxsq2020101047)。

摘　　要：采用乙二醇溶剂热的方法制备了分散性良好、粒径均一的球形氧化铈抛光粉,并通过浸渍法在氧化铈的表面引入氧化铜(CuO),研究了不同含量CuO对氧化铈的物相结构、比表面积、尺寸、表面形貌、氧化还原能力等的影响,结果表明,在负载范围内,CuO对氧化铈的物相结构、形貌及宏观粒度分布并无明显影响,但其比表面积以及氧化还原能力发生明显的改变。抛光测试结果表明,CuO的引入会明显改变铈基抛光粉的抛光能力。当Cu占Cu和Ce原子摩尔总量的5%时,抛光粉的抛光性能最佳,抛光速率高达213.4 nm/min,抛光后硅片表面的粗糙度仅为0.239 nm(Rq)和0.188 nm(Ra)。通过溶剂热的方法合成的氧化铈抛光粉形貌及尺寸良好,制备方法简单、生产成本低,经过CuO修饰后的氧化铈形貌及尺寸并未发生改变,抛光性能得到较大提升。该策略在提高铈基抛光粉的抛光能力方面具有一定的普适性。The cerium oxide polishing powder with good dispersion and uniform particle size was prepared by ethylene glycol solvothermal method,and copper oxide(CuO)was introduced on the surface of cerium oxide by impregnation method.The effects of different contents of CuO on the phase structure,specific surface area,size,surface morphology and redox capacity of cerium oxide were studied,and it was found that there was no significant effect on the phase structure,morphology and macroscopic particle size distribution of cerium oxide within the loading range,but the specific surface area and redox capacity changed significantly.The polishing test showed that the introduction of CuO would significantly change the polishing ability of cerium-based polishing powder.When Cu accounts for 5%of the total molar amount of Cu and Ce atoms,the polishing performance was the best,the polishing rate was as high as 213.4 nm/min,and the roughness of the surface of the silicon wafer after polishing was only 0.239 nm(Rq)and 0.188 nm(Ra).The morphology and size of cerium oxide polishing powder synthesized by solvothermal method were fine,and the preparation method was simple and cost-effective.What’s more,the morphology and size of cerium oxide modified by CuO were not changed,and the polishing performance has been greatly improved.This work has certain universality in improving the polishing ability of cerium-based polishing powder.

关 键 词：二氧化铈 溶剂热法 表面修饰 化学机械抛光 稀土氧化物 

分 类 号：TB321[一般工业技术—材料科学与工程]