增强型CCGA焊柱的热疲劳寿命研究  

Study on Thermal Fatigue Life of Enhanced CCGA Solder Column

作　　者：张元伟 张炜杰 邹振兴 方玉财 张振越 ZHANG Yuanwei;ZHANG Weijie;ZOU Zhenxing;FANG Yucai;ZHANG Zhenyue(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)

机构地区：[1]中国电子科技集团公司第五十八研究所,江苏无锡214035

出　　处：《电子产品可靠性与环境试验》2022年第6期50-53,共4页Electronic Product Reliability and Environmental Testing

摘　　要：随着陶瓷柱栅阵列(CCGA)封装的广泛应用,其焊柱在温度循环条件下的热疲劳寿命预测也越来越重要。首先,建立了简化后的CCGA封装结构模型;其次,基于描述焊料变形行为的Anand本构方程,借助有限元进行热疲劳仿真;最后,使用基于Coffin-Manson方程的热疲劳寿命预测模型,比较了镀铜型焊柱和铜带缠绕型焊柱的热疲劳寿命,结果表明后者的热疲劳寿命是前者的1.6倍,由此可以在疲劳寿命的评估中,确定可靠性最优的焊柱类型。With the wide application of Ceramic Column Grid Array(CCGA),the thermal fatigue life prediction of solder column under temperature cycle is becoming more and more important.Firstly,the simplified CCGA structure model is established.Then,based on Anand constitutive equations used to describe solder deformation behavior,thermal fatigue simulation is carried out with the help of finite element.Finally,the themal fatigue life prediction model based on Coffin-Manson equation is used to compare the thermal fatigue life of copper plated solder column and copper stripe wound solder column.The results show that the fatigue life of the latter is 1.6 times that of the former.Thus,the welding column type with optimal reliability can be determined in the evaluation of fatigue life.

关 键 词：陶瓷柱栅阵列 焊柱 焊料 热疲劳 仿真 寿命预测 

分 类 号：TP391.99[自动化与计算机技术—计算机应用技术]