AlN陶瓷热导率及抗弯强度影响因素研究的新进展  

The latest research progress on thermal conductivity and bending strength of AlN ceramics

作　　者：王露露 马北越 刘春明 邓承继[3] 于景坤 Wang Lulu;Ma Beiyue;Liu Chunming;Deng Chengji;Yu Jingkun(School of Materials Science and Engineering,Northeastern Un iversity,Shenyang 110819,China;School of Metallurgy,Northeastern University,Shenyang 110819,China;The State Key Laboratory of Refractories and Metallurgy,Wuh an University of Science and Technology,Wuhan 430081,China)

机构地区：[1]东北大学材料科学与工程学院,沈阳110819 [2]东北大学冶金学院,沈阳110819 [3]武汉科技大学省部共建耐火材料与冶金国家重点实验室,武汉430081

出　　处：《耐火与石灰》2023年第1期23-29,共7页Refractories & Lime

基　　金：国家自然科学基金自助项目(U20A20239)。

摘　　要：AlN陶瓷因具有高热导率、高强度及介电常数小等优点被广泛应用于结构陶瓷、防弹及耐磨材料、基片和封装材料等方面。本文综述了AlN陶瓷研究现状,包括AlN陶瓷基础性能、热导率及抗弯强度影响因素研究新进展。在此基础上,指出了AlN陶瓷研究及应用过程中存在的问题,并展望了AlN陶瓷发展趋势。AlN ceramics are widely used in structural ceramics, bulletproof and wear-resistant materials, substrates and packaging materials because of their high thermal conductivity,high strength and low dielectric constant. This article reviews the current research status of AlN ceramics,including the new developments of basic properties,thermal conductivity and flexural strength of AlN ceramics. On this basis,the problems in the research and application of AlN ceramics are pointed out,and the development trend of AlN ceramics is prospected.

关 键 词：ALN陶瓷 热导率 抗弯强度 研究进展 

分 类 号：TQ174.1[化学工程—陶瓷工业]